Executive Team - Click on name for bio and email address
- Craig Hillman, CEO and Managing Partner
Email Address: email@example.com
Dr. Hillman’s specialties include best practices in Design for Reliability (DfR), Pb-Free strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology (capacitors, resistors, etc.), and printed board failure mechanisms. Dr. Hillman has over 40 Publications and has presented on a wide variety of reliability issues to over 250 companies and organizations.
- Post-doctoral fellowship (Cambridge University)
- Ph.D., Materials (University of California, Santa Barbara)
- B.S., Metallurgical Engineering and Material Science (Carnegie Mellon)
- Nathan Blattau, Senior Vice President
Email Address: firstname.lastname@example.org
Dr. Blattau has been involved in the packaging and reliability of electronic equipment for over eight years. Dr. Blattau is also experienced in failure analysis and accelerated testing methods. His primary research interests are in the areas of design-for-reliability in electronic packaging, nonlinear finite element analysis, solder joint reliability, fracture, and fatigue mechanics of materials.
- Ph.D., Mechanical Engineering (University of Maryland)
- M.S., Mechanical Engineering (University of Maryland)
- B.S., Civil Engineering (University of Maryland)
Senior Technical Team - Click on name for bio and email address
- Greg Caswell
Email Address: email@example.com
Mr. Caswell is an industry renowned expert in the fields of SMT, advanced packaging, printed board fabrication, circuit card assembly, and bonding solutions using nanotechnology. He has been well-regarded as a leader in the electronics contract manufacturing and component packaging industries for the past 30 years. His previous appointments include Vice President of Business Development for Newport Enterprises, Director of Engineering for VirTex Assembly Services, and Technical Director at Silicon Hills Design. Most recently, Greg was the Vice President of Engineering at Reactive Nanotechnology (RNT), where he led application development for the RNT Nanofoil® and ensured a successful transition of product technology to Indium Corporation. Greg continues to be the leading expert in NanoBonding® implementation for component mounting applications.
- B.A., Management (St. Edwards University)
- B.S., Electrical Engineering (Rutgers University)
- Annie Drees
Email Address: firstname.lastname@example.org
Ms. Drees is an experienced circuit designer with a concentration in high speed digital design. Annie spent eight years at Dell, where she led teams to create and deliver high-end motherboards. Being on the frontlines of new technology, Annie has debugged silicon, circuit and software issues. Annie left Dell to pursue other opportunities in innovation. In the past year Annie has created custom engineering solutions for clients in diverse industries while working for SurfaceInk. Annie’s strengths in problem solving stem from her sharp analytical skills and methodical approach.
- James McLeish
Email Address: email@example.com
Mr. McLeish has 30 years of automotive Electrical/Electronics (E/E) experience. He has worked in systems engineering, design, development, production, validation, reliability and quality assurance of both components and vehicle systems. He holds three patents, is the author or co-author of three GM E/E validation and test standards and is credited with the introduction of Physics-of-Failure engineering techniques to GM.
- MSEE, Automotive Control Systems (Wayne State University)
- BSEE, Electronics Engineering (Lawrence Technological University)
- Petri Savolainen
Email Address: firstname.lastname@example.org
- Randy Schueller
Email Address: email@example.com
Dr. Schueller has held numerous management and leadership positions at companies including 3M and Extreme Devices (an Austin high tech start-up company), where he developed flex-based IC packages. He has also worked at Dell, where he assisted in resolving failures in IC packages, connectors, PWBs, and assembly issues. He currently holds 15 patents and has authored and presented over 30 papers within the electronics industry. Dr. Schueller is the head of DfR’s office in Minneapolis, Minnesota, which opened in November 2008.
- Ph.D., Materials Science and Engineering (University of Virginia)
- M.S., Materials Science and Engineering (University of Virginia)
- B.S., Physics (St. John’s University)
- Gilad Sharon
Email Address: firstname.lastname@example.org
Dr. Sharon’s research focus was mechanical reliability of electronic systems and components. His doctoral research included solder reliability, MEMS structures characterization, embedded components failure analysis and particle beam accelerator mechanical fatigue. Gil worked at Amkor technology in the Advanced Product Development Group as Senior Engineer. His activity there explored chip-package interactions. Research Interests: Multidisciplinary reliability of complex electro mechanical systems. Characterization and modeling of material behavior. Mechanical performance of flip chip packages. Physics of failure of electromechanical and MEMS system.
- B.S. , Mechanical Engineering (University of Maryland)
- Ph.D, Mechanical Engineering (University of Maryland)
- Cheryl Tulkoff
Email Address: email@example.com
Cheryl Tulkoff is an industry renowned expert in the fields of semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. Prior to joining DfR, Ms. Tulkoff had an active leadership role both within her employer’s companies and among regional and national electronics and reliability organizations. At her most recent position at National Instruments, Cheryl developed a comprehensive reliability organization, including the creation of an internal failure analysis group and a closed loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication through her work at Cypress Semiconductor in electronics assembly, and through her work at IBM. Cheryl is the head of DfR’s newest office located in Austin, Texas, which opened in February 2009.
- B.S., Mechanical Engineering (Georgia Institute of Technology)
- Ron Wunderlich
Email Address: firstname.lastname@example.org
Dr. Wunderlich is widely recognized as a leader in the design, analysis and diagnostics of power supply and analog circuitry. He is highly proficient in switch mode power supply design, analog circuitry, magnetic components, power supply switching ASICs and simulation at both macro level and device physics level. Customers have experienced a particularly high level of return on investment (ROI) with Ron’s Design for EMI/EMC activities. Ron has been responsible for power supply CCA and ASIC design and development, among other activities at Celestica and IBM. Dr. Wunderlich holds 6 patents and has authored 20 papers.
- Ph.D., Electrical Engineering (SUNY-Binghamton)
- MSEE, Electrical Engineering (Syracuse University)
- BSEE, Electrical Engineering (RIT)