This October, the International Microelectronics Assembly and Packaging Society (IMAPS) will hold its 50th Anniversary Symposium in Raleigh, North Carolina. It will be the society's largest event to date, with 25 breakout sessions, 4 keynotes, and more than 140 speakers in a 3-day span, from October 10th-12th. Luckily for us, our own Greg Caswell will be doing more than just speaking at IMAPS 2017, he’s also been named one of the committee chairs of the event and has been nominated for the lifetime achievement award! Last week, I sat down with Greg to get an inside scoop on what to expect, as well as learn more about his involvement with IMAPS.
Why should people plan to attend IMAPS 2017?
The IMAPS Symposium is the best conference addressing microelectronic packaging, and it draws thousands of attendees each year. It’s an extremely tight technical program of courses and papers to help educate those in the industry, and there will be many extras this year to celebrate IMAPS' 50th anniversary. There are also a number of ancillary activities offered at the high school and college levels that are designed to help the next generation of engineers learn more about microelectronics, win scholarships, and connect with experts.
How has IMAPS impacted the electronic packaging industry?
Over the past 50 years, IMAPS has led the industry with regard to advancing cutting edge innovations for electronic packaging. The society’s various events and workshops throughout the years have addressed technical issues and new advancements in materials, packages, assembly and reliability, making the next generation of products more viable. That is definitely worth celebrating!
The convention center will feature photo collages of the people and projects that have impacted the industry over the last 50 years of the society. We’ve been collecting these photos from people around the world so it will truly be a sight to see. Attendees will also be viewing an on-screen presentation of IMAPS events over the years as well as a collection of electronic hardware that will show guests the advancements the industry has made.
Tell us about the courses/sessions that you’re presenting at IMAPS 2017. What can attendees expect to learn at each?
On Monday, October 9, at 10:30 a.m. I will be sharing information related to designing for reliability, failure modes, physics of failure, thermal-mechanical stresses, and predicting integrated circuit (IC) wearout in my presentation titled, A Methodology for Understanding the Reliability of Electronic Packaging, which will take place during the Professional Development Course track.
I’ll also be reviewing 6 technical papers focused on different aspects of electronic reliability in a breakout session titled Advanced Materials & Processes with Tim Jensen from Indium Corporation on Thursday, October 12. The paper that I’ll be presenting during this session is titled Surviving the Heat Wave: A Presentation of Thermally Induced Failures and Reliability Risks Created by Advancements in Electronic Technologies, and it will address common thermally-induced reliability risks in today's electronics and how to effectively manage them to help ensure predicted product reliability.
Registration for the event is open and if you hurry, you can still take advantage of special early bird pricing (through September 8). Don’t miss out on the best event in microelectronic packaging, and celebrating the 50th anniversary of IMAPS!
To learn insights from Greg Caswell prior to IMAPS 2017, watch his popular webinar, Best Practices in Avoiding Pad Cratering and Capacitor Cracking, on-demand by clicking below.