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How Modeling for Component Packaging Has Changed

Posted by Greg Caswell on Jan 4, 2017 9:24:00 AM

electronic-component.jpgThe constant demand for smaller, faster, more reliable electronic components continues to drive innovation in component packaging. Component engineers are relentless in their quest for new and better ways to improve BGAs and packaging silicon. Recent advancements include going coreless and multi-chip modules, but silicon technology advances dictate continued improvement in packaging.

Multi layered packages exhibit several failure modes that can be predicted using modern software tools that haven’t always been available. How have these advances changed electronics failure prediction?

  • Accessibility: Automation eliminates the need for modeling expertise. Making a full three dimensional finite element model used to be a difficult and lengthy process. Expert modelers spent many hours to create the models from layout files. Modern software provides ease. Automation allows the reliability experts and their teams, who need not be modeling experts, to directly interact with the substrate model.
  • Affordability: Detailed trace modeling is readily available and not cost prohibitive. This capability used to be prohibitively expensive for large packages and substrates with many metal levels but new options have made it affordable. Advanced automated design analysis software trace modeling capabilities improve the model while shortening the creation time. Abaqus Unified FEA is a software suite that works in conjunction with design analysis software for finite element analysis and computer-aided engineering. It can be used in modeling cars, airplanes, etc but also thermo-mechanical stresses.
  • Efficiency: Software can automatically create high-fidelity substrate models in a fraction of the time needed for traditional modeling, with more accurate results. These modern combinations of FEA and design analysis software can predict stresses and failures early on. The high-fidelity model provides the predictive capability that allows designers to adjust the layout in the design phase, before prototyping and before manufacturing expense is incurred. The model can easily be converted to perform analyses from mechanical performance to electromagnetic, thermal and multi-physics simulations.

Failures in the increasingly smaller, faster world of electronics components can have big implications. Using software like Sherlock Automated Design Analysis™ and Abaqus Unified FEA makes it easier to achieve accurate, reliable modeling before prototyping -- saving time, money and effort. Find out more about software simulation in Guarantee Reliability with Mechanical Shock Simulation. Click the button to download access this webinar. 

Guarantee Reliability with Mechanical Shock Simulations Webinar

Topics: Sherlock