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How Scanning Acoustic Microscopy Aids in Electronics Failure Analysis

Posted by James McLeish on Apr 25, 2017 11:20:00 AM

Decapsulation and cross-sectioning are two failure analysis techniques frequently used to root cause failure issues in electronics.  However, these destructive methods that are expensive and time consuming,  can be made more effective by the use of Scanning Acoustic Microscopy (SAM)  to identify the most likely failure site for destructive methods to be focused on. 

Topics: Failure Analysis

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