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How to Accurately Assess PCB Warpage and Solder Joint Fatigue in QFN Packages

Posted by Maxim Serebreni on Jul 25, 2017 9:33:00 AM

Industry interest in producing thinner and smaller integrated circuit (IC) packages to match the performance of chip scale packages has resulted in the wide application of quad flat no-lead (QFN) components. However, the small-form factor of QFN packages can place solder joints at risk of coefficient of thermal expansion (CTE) mismatch, which can potentially lead to PCB warping and failure. To help mitigate this risk and accurately assess the fatigue life of solder interconnects in QFN packages, a predictive model incorporating the material and geometric parameters that influence solder joint fatigue should be used.

Topics: Physics of Failure, QFN Packages, Solder Joint Fatigue

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