DfR Solutions Reliability Designed and Delivered

How Modeling for Component Packaging Has Changed

Posted by Greg Caswell on Jan 4, 2017 9:24:00 AM

The constant demand for smaller, faster, more reliable electronic components continues to drive innovation in component packaging. Component engineers are relentless in their quest for new and better ways to improve BGAs and packaging silicon. Recent advancements include going coreless and multi-chip modules, but silicon technology advances dictate continued improvement in packaging.

Topics: Sherlock

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4 Factors That Must Be Addressed During Product Lifecycle Simulation

Posted by Greg Caswell on Dec 7, 2016 9:30:00 AM

Product lifecycle simulation is an effective tool for determining how long electronics in automotive and other applications will perform before failing. However, there are four distinct categories of electronics with disparate levels of lifetime expectations:

Topics: Sherlock

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3 Ways to Mitigate Manufacturing Failure Risk

Posted by Craig Hillman on Dec 2, 2016 9:40:17 AM

Failure is a possibility with any component on any PCB. In many cases wearout is the culprit, leaving engineers to deal with the aftermath of dissecting what went wrong and possibly re-engineering the component to avoid recurrence.

Topics: Sherlock

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How to Eliminate the Need for Failure Analysis

Posted by Greg Caswell on Nov 30, 2016 7:50:00 AM

Nearly one-fifth of electronics designs that are tested fail. That means nearly one-fifth of electronics designs are reworked or scrapped in favor of a new design. The resulting production delays and cost overruns mount, further threatening profitability in an automotive industry that’s already grappling with the margin-shrinking impact of increasing price-based competition. 

Topics: Sherlock

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Evaluating the Impact of Prolonged Thermal Cycling on Automotive Reliability

Posted by James McLeish on Nov 11, 2016 9:30:00 AM

Automotive electronics are routinely exposed to harsh environments that introduce internal and external factors that could cause failure. Of particular concern is thermal cycling since automobiles are ideally designed to last more than a decade, during which time regular and frequently major temperature fluctuations occur. Long-term product life combined with prolonged thermal cycling present unique failure risks.

Topics: Sherlock

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How to Predict and Prevent Automotive Power Module Failure

Posted by Greg Caswell on Nov 4, 2016 9:30:00 AM

Just because an automotive power module has a projected 20-year life expectancy doesn’t guarantee long-term reliability. In fact, these modules are routinely exposed to vibration, shock, humidity, salt spray and other factors that can quickly degrade power and ultimately cause failure. 

Topics: Sherlock

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How Robust Designs Enhance Automotive Power Module Reliability

Posted by Greg Caswell on Nov 2, 2016 9:30:00 AM

The automotive industry, among others, depends on power modules to house and protect delicate semiconductors and other components that power various automobile functions. Given the vital importance of power modules in relation to product reliability, a robust design must be in place in order to mitigate risk from defect, create margins and ultimately satisfy customer expectations.

Topics: Sherlock

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How To Answer Reliability and Insurance Questions After an Adverse Event

Posted by Greg Caswell on Oct 26, 2016 9:30:00 AM

Reliability is the desired result of product design and testing. Rightly so, as everything from functionality, safety and a brand’s reputation hinges on it.

Topics: Sherlock

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Optimizing Automotive Component Reliability with Sherlock

Posted by James McLeish on Oct 21, 2016 9:30:00 AM

Vehicle technology is rapidly becoming a key differentiator in the automotive industry. To stay ahead of the competition, manufacturers are tasked with devising new ways to optimize automotive electronics without compromising components or performance.

Topics: Sherlock

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Reliability Modeling of MEMS in Automotive Systems

Posted by James McLeish on Oct 14, 2016 9:30:00 AM

Micro-Electro-Mechanical Systems (MEMS) are increasingly used in safety-critical vehicle systems. This introduces new and evolving silicon and semiconductor packaging technology, and greater failure risk. Computer-aided engineering (CAE) tools are needed to evaluate, eliminate or mitigate susceptibilities to failure modes during MEMS device design.

Topics: Sherlock, Design for Reliability

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