From simple projects to million-dollar programs, DfR Solutions can conduct the research you need — quickly, efficiently, and at a reasonable cost. DfR’s current research activities include:
- Development of an interconnect reliability model for Sn-Ag-Cu (SAC) and Sn-Ni-Cu (SNC) solders
- Reliability prediction and time to failure behavior of current (90nm and 65nm) and next (45nm) generation integrated circuits
- Wearout behavior and quality indicators of liquid aluminum electrolytic capacitors with low ESR electrolyte
- Industry surveys of quality and reliability practices for component engineering
- Technology assessment of system in package (SiP) configurations (materials, design, process)
- Vibration and mechanical shock behaviors of 1st- and 2nd-generation lead-free solders
- Influence of higher reflow temperatures on the robustness of large, complex printed circuit boards
- Process optimization and environmental degradation of conductive adhesives
For more information on DfR Solutions’ research, contact us at 301-474-0607 or via email.
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