From simple projects to million-dollar programs, DfR Solutions can conduct the research you need — quickly, efficiently, and at a reasonable cost. DfR's current research activities include:

• Development of a time-to-failure model for ceramic capacitors with high capacitance/volume ratio
• Development of an interconnect reliability model for Sn-Ag-Cu (SAC) and Sn-Ni-Cu (SNC) solders
• Step stress testing of aluminum electrolytic capacitors after initial exposure at lower voltages - What is the specification range which is appropriate for electrolytics?
• Surface insulation resistance of Pb-free solder pastes
• CAF resistance of printed boards fabricated with supercritical silanes moisture induced degradation of polymeric capacitors
• Board level drop impact test of FBGA in mobile application
• Qualification of alloy42 based Pd PPF leadframe package

For more information on DfR Solutions' research contact us at 301-474-0607, or via email.