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Course Archive
A List of Courses That DfR Solutions Has Given:
For more information, or to schedule a seminar on-site at your location, call us at 301-474-0607, or send us an email.
2010
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Next Generation Technologies in Electronic Packaging and Production Nistec Seminar, Herzliya, Israel July 2010 |
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Design for Reliability Nistec Seminar, Herzliya, Israel July 2010 |
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Counterfeit Prevention & Detection Strategies: Cost vs Risk Assessment SMTA Symposium on Counterfeit Electronic Parts (West), Phoenix, AZ June 2010 |
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Manufacturing and Reliability Challenges with QFN iMAPS Mid-Atlantic Conference, Atlantic City, NJ June 2010 |
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Common Hardware Mistakes by Embedded Systems Designers Embedded Systems Conference - Midwest, Chicago, IL June 2010 |
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Contamination and Cleanliness: Developing Practical Responses to a Challenging Problem iMAPS Nordic, Goteborg, Sweden June 2010 |
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True Design for Reliability SMTA Pb-Free Academy, Toronto, Canada May 2010 |

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Reality of Pb-Free Reliability SMTA Pb-Free Academy, Toronto, Canada May 2010 |
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Advanced: Common Hardware Mistakes by Embedded System Designers Embedded Systems Conference Silicon Valley, San Jose, CA April 2010 |
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Introductory: Common Hardware Mistakes by Embedded System Designers Embedded Systems Conference Silicon Valley, San Jose, CA April 2010 |
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The Introduction of Tensile Ratcheting in Solder Bumps Encapsulated in Low Tg Underfill iMAPS Device Packaging Conference, Phoenix, AZ March 2010 |
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Selection of a Surface Finish SMTA Chapter Meeting, Minneapolis, MN February 2010 |
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Ensuring and Predicting the Reliability of Concentrated Photovoltaics (CPV): Interconnect Structures Photovoltaic Module Reliability Workshop, Golden, CO February 2010 |
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Manufacturing and Reliability Challenges with QFN iMAPS Chesapeake, Laurel, Maryland January 2010 |
2009
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Manufacturing and Reliability Challenges with QFN Central Texas Electronics Association, Austin, Texas October 2009 |
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Failure Analysis in Electronics: An Overview SMQ Laboratories, Shenzhen, China June 2009 |
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Manufacturing and Reliability Challenges with QFN SMTA/iMAPS, Boston, MA April 2009 |
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How I Learned to Stop Worrying and Design Reliability In IEEE Reliability Society, Dallas, TX March 2009 |
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Next Generation Technologies in Electronic Packaging and Production IPC APEX Expo, Las Vegas, NV March 2009 |
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Design for Reliability: A Physics of Failure Based Approach IPC APEX Expo, Las Vegas, NV March 2009 |
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The Reality of Pb-free Reliability IPC APEX Expo, Las Vegas, NV March 2009 |
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Manufacturing and Reliability Challenges with QFN SMTA DC Chapter, Ashburn, VA February 2009 |
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Understanding Failure and Root-Cause Analysis in Electronics SMTA Academy, Anaheim, CA February 2009 |
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Pb-Free & Medical Applications SMTA Academy, Anaheim, CA February 2009 |
2008
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The Fatigue Behavior of Pb-Free Solder SMTA Long Island Academy, Long Island, NY October 2008 |
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The Reality of Pb-Free Reliability SMTA Nutmeg, Southbury, CT October 2008 |
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Understanding Failure and Root-Cause Analysis in Pb-Free Electronics IPC Midwest, Chicago, IL September 2008 |
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Next Generation Technologies in Electronic Packaging and Production IPC Midwest, Chicago, IL September 2008 |
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The Affects of REACH on the Electronics Industry SMTA Capitol Chapter Vendor Day, Laurel, MD September 2008 |
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Next Generation Technologies SMTA International, Orlando, FL August 2008 |
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Understanding Failure and Root-Cause Analysis in Pb-Free Electronics SMTA International, Orlando, FL August 2008 |
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Understanding the Motivation and Basics of Root-Cause Analysis Webcast July 2008 |
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The Reality of Pb-Free Reliability SMTA International, Toronto, Canada May 2008 |
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Common Hardware Mistakes by Embedded System Designers Embedded Systems Conference, San Jose, CA April 2008 |
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True Design for Reliability: Understanding What Is and What Is Not DfR IPC Printed Circuits Expo/APEX, Las Vegas, NV March 2008 |
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Understanding Failure and Root-Cause Analysis in Pb-Free Electronics IPC Printed Circuits Expo/APEX, Las Vegas, NV March 2008 |
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Robustness of Printed Wiring Boards to Pb-free Reflow and the Influence of Absorbed Moisture SMTA International, Webcast March 2008 |
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The Paradigm Shift in Design Assurance and Reliability Prediction Commercialization of Military and Space Electronics, San Diego, CA February 2008 |
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How to Develop a Qualification Test Plan for RoHS Products Reliability and Maintainability Symposium, Las Vegas, NV January 2008 |
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Developing a Pb-Free Qualification Plan for Hi-Rel Applications LEAP Working Group, Irving, TX January 2008 |
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Selecting a Pb-Free Solution for Military, Avionic, and Space Applications SMTA Anaheim Academy, Anaheim, CA January 2008 |
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A Perspective on the Reliability of MEMS for Telecommunications Photonics West, San Jose, CA January 2008 |
2007
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Specifying Printed Cicuit Boards Florham Park, NJ November 2007 |
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Selecting a Pb-Free Solution for Military, Avionic, and Space Applications SMTA International, Orlando, FL November 2007 |
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Selecting a Pb-Free Solution for Military, Avionic, and Space Applications SMTA International, Orlando, FL October 2007 |
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Best Practices in Failure Avoidance PTI, San Jose, CA October 2007 |
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Understanding Failure and Root-Cause Analysis in Pb-Free Electronics San Francisco, CA October 2007 |
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Ensuring Quality and Reliability in Printed Circuit Boards Boston, MA September 2007 |
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Best Practices in Failure Avoidance SEMICON West, San Francisco, CA July 2007 |
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Understanding Failure and Root-Cause Analysis in Pb-Free Electronics SEMICON West, San Francisco, CA July 2007 |
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Design for Manufacturability/Assembly Asian Convergence for Electronics, Kuala Lumpur, Malaysia June 2007 |
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Pb-Free Interconnection: Technology and Connection Asian Convergence for Electronics, Kuala Lumpur, Malaysia June 2007 |
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Selecting a Pb-Free Solution for Military, Avionic, and Space Applications AIMS Harch Electronics Workshop, Indianapolis, IN June 2007 |
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Failure and Root-Cause Analysis in Medical Electronics SMTA Medical Electronics Symposium, Bloomington, MN May 2007 |
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Reality of Pb-Free Reliability SMTA International, Toronto, Canada, April 2007 |
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Best Practices of Failure Analysis Milpitas, CA March 2007 |
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Selecting a Pb-Free Solution for Military, Avionic and Space Applications Commercialization of Military and Space Electronics, Los Angeles, CA March 2007 |
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Controlling and Qualifying Pb-free Components Anaheim, CA February 2007 |
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Understanding Failure and Root-Cause Analysis in Pb-Free Electronics IPC Printed Circuits Expo, Los Angeles, CA February 2007 |
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Risk Minimization for Pb-Free Design in Telecommunication Products North American Regulatory Conference for Electronics Products, Shenzhen, China January 2007 |
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Failure Analysis for Electronics North American Regulatory Conference for Electronics Products, Shenzhen, China January 2007 |
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Simplified Failure Model for Pb-Free Solder LEAP Florida, Coral Gables, Florida January 2007 |
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Whisker-Resistant Plating Usage by Major Semiconductor Manufacturers LEAP Florida, Coral Gables, Florida January 2007 |
2006
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Understanding Failure and Root-Cause Analysis in Pb-Free Electronics IPC/JEDEC International Conference on Lead-free Electronics, Boston, MA December 2006 |
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Pb-Free Solder Reliability TMS/SMTA, Webcast November 2006K |
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Root-Cause Analysis in Electronics Burlington, Canada November 2006 |
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How to be Compliant with the New GEIA/IEC Specifications for Pb-Free Products in Military Applications DMC, Nashville, TN November 2006 |
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Understanding Failure and Root-Cause Analysis in Pb-Free Electronics IPC/JEDEC International Conference on Pb-Free Electronics, Frankfurt, Germany November 2006 |
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Reality of Pb-Free Reliability DfR Solutions, Webcast October 2006 |
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Understanding Failure and Root-Cause Analysis in Pb-Free Electronics IPC/JEDEC International Conference on Pb-Free Electronics, Singapore October 2006 |
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Integrating Advanced QRD (Quality, Reliability, Durability) Tactics with Accelerated Product Development Accelerated Reliability Technology Symposium (ARTS), New York, NY September 2006 |
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Reality of Pb-Free Reliability Surface Mount Technology Association International, Chicago, IL September 2006 |
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The Comprehensive Guide to Uprating in Electronic Components Shenzhen, China July 2006 |
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Performance of Pb-Free Materials in Electronics Components for Military & Space Electronics (CMSE), Portsmouth, UK June 2006 |
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Reliability Assurance in Medical Electronics SMTA Medical Electronics, Minneapolis, MN May 2006 |
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The Reality of Pb-Free Reliability NEPCON East, Boston, MA May 2006 |
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Pb-Free Reliability Del Mar Electronics Show: Race to RoHS, San Diego, CA April 2006 |
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Integrating Advanced QRD Tactics with Accelerated Product Development HALT/HASS Workshop DfR Solutions, College Park, MD April 2006 |
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HALT/HASS and Best Practices in Reliability HALT/HASS Workshop DfR Solutions, College Park, MD April 2006 |
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Pb-Free and Related Concerns Society of Reliability Engineers (Washington Chapter), Washington, DC March 2006 |
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Failure Avoidance in Military and Space Electronics Components for Military & Space Electronics Conference (CMSE), Los Angeles, CA February 2006 |
2005 and Prior
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Red Phosphorus, Bulging Capacitors: What Went Wrong with the Supply Chain and Why It Will Happen Again DfR Solutions, Webcast November 2005 |
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Understanding RoHS/WEEE Requirements Manufacturing and Economic Recovery Conference (MERC), Chicago, IL October 2005 |
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Best Practices in Reliability MIT/Industry Consortium on Advanced Automotive Electrical/Electronic Components and Systems, Boston, MA 2005 |
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Understanding the Role of Root-Cause Analysis in the HALT Process Boston, MA October 2005 |
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Reality of Pb-Free Reliability SMTA International, Chicago, IL September 2005 |
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Reality of Pb-Free Reliability SMTA, Webcast July 2005 |
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Electrochemical Migration Mechanisms in Electronics Shenzhen, China June 2005 |
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Reality of Pb-Free Reliability IEEE Reliability Society, Boston, MA May 2005 |
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Reality of Pb-free Reliability Boston, MA May 2005 |
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Design for Reliability ITLAM, Herzila, Israel March 2005 |
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Reality of Pb-Free Reliability ITLAM, Herzila, Israel March 2005 |
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Failures at the Customer and the Influence of Pb-Free IEEE Components, Packaging, and Manufacturing Technology Society, Santa Clara, CA October 2004 |
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Design for Reliability Gumi Institute of Electronic Technology, Gumi, Korea October 2004 |
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Printed Circuit Board Failure Mechanisms Windsor, CT June 2003 |
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Pb-Free Soldering Technology ILTAM, Herzlia, Israel January 2002 |
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