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A New (Better) Approach to Tin Whisker Mitigation

Posted by Craig Hillman, Gregg Kittlesen, and Randy Schueller on Aug 31, 2016 8:31:12 PM

Most of the electronics industry by now knows about tin whiskers. They know whiskers are slim metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures (see nepp.nasa.gov/whisker/ for a list longer than you need). But, with all of this knowledge, the industry is still struggling on how to predict and prevent these “Nefarious Needles of Pain”.

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Topics: Environmental testing, whiskers

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