A Review of Models for Time-to-Failure Due to Metallic Migration Mechanisms

Posted by Elissa Bumiller and Dr. Craig Hillman on Aug 28, 2016 4:00:49 PM

Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias [1]. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)[2,3].


Topics: PCB, ECM

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