Common Reliability Problems in Opto-Electronic Packaging: Epoxies

Posted by John C McNulty, PhD on Aug 23, 2016 11:49:24 AM

This is the first of a series of perspectives on common, but avoidable, problems that I have encountered in the development and qualification of components for use in high reliability opto-electronic applications. Some of these problems may appear intuitive, and therefore absurd, to engineers with specific academic or established telecom OEM backgrounds, where projects run for many years and are supported by significant past experience and/or applied research. However, the proliferation of start-ups, radical shortening of development cycles, general dilution of knowledgeable engineers (both in vendors’ product development and customers’ reliability assessment groups), constant cost reduction pressure from customers, and outsourcing/offshore production have all colluded to promote quick, ill-informed design and process decisions. One of the key value propositions of DfR Solutions is to provide guidance during the design and development phases, in order to avoid expensive and reputation-damaging mistakes in the future.


Topics: OEMs, reliability

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