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Design and Process Guidelines for QFNs: Manufacturability and Compatibility

One of the fastest growing package types in the electronics industry today is Quad Flat Pack No Lead (QFN). This package is also known as Quad Flat Non- Leaded (QFN), Leadframe Chip Scale Package (LF- CSP), MicroLeadFrame (MLF), MLP, LPCC, QLP, and HVQFN. It consists of an overmolded leadframe with bond pads exposed on the bottom and arranged along the periphery of the package.

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Topics: QFN, Manufacturability

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