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Failure Modes in Conductive Adhesives

Posted by Petri Savolainen on Aug 31, 2016 8:35:54 PM

Conductive adhesives offer lead-free, low temperature attachment for various types of electronics applications. They are composite materials consisting of a polymer matrix (adhesion, strength) and conductive filler (electric conductivity). Due to the nature of polymers, it is relatively easy to tailor adhesive properties to match the specific requirements. Selection of the filler depends on the application.

Conductive adhesives have been used in the electronics industry for a long time. Silver-filled Isotropic Conductive Adhesives (ICA) were first used for die bonding in hybrid circuits. Many other applications have appeared since the introduction of ICAs. Anisotropic Conductive Adhesives (ACA) were developed for attaching driver circuits to Liquid Crystal Displays (LCDs) for calculators. Today, ACAs are a cornerstone for the display industry allowing the use of Chip-on- Glass and Chip-on-Flex technologies and enabling fast, reliable, and lightweight solutions for driving the displays [1]. ICAs are used in various applications from die attach to space applications.

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Topics: failure modes, Conductive adhesives, ICA

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