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Moisture in Hermetic Packages

Posted by Craig Hillman on Aug 30, 2016 4:48:56 PM

Hermetic packaging of micro-electronic and opto-electronic devices is commonly utilized to protect the devices from aggressive application environments (submarine; outdoor industrial and telecom; space). While many failure modes exist (seal failures; outgassing of organics; evolution of secondary gas species), the most commonly observed failure modes are due to trapped water vapor and possible condensation onto critical surfaces/devices. General guidelines and test procedures are standard across many industries, but even the best device packaging companies occasionally experience water vapor-induced issues due to material selection, process/supplier changes, and/or equipment degradation.

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Topics: Failure Analysis, hermetic packages, moisture

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