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Quality and Reliability Challenges for Package‐on‐Package

Posted by Craig Hillman and Randy Kong on Aug 28, 2016 3:52:54 PM

emiconductor technology advances have been fulfilling Moore’s law for many decades. However, with feature sizes approaching atomic dimensions, alternative technologies will be needed to meet the evolving performance, size and cost demands driven by applications from mobile to cloud computing. One example of such technologies is heterogeneous semiconductor packaging technology such as 3D packaging.

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Topics: POP, Quality, reliability, Semiconductor technology

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