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Red Phosphorus Induced Failures in Encapsulated Circuits

Posted by Craig Hillman on Aug 31, 2016 11:13:53 PM

This paper discusses the reliability risks of using red phosphorus as a flame retardant material in encapsulated microcircuits. The focus is on chemical reactions, which can arise when red phosphorus is exposed to ambient humidity at high temperatures to form oxygen-containing phosphorus acids. These acids are corrosive and can alter the physical and electrical characteristics of the polymer composition and are root-cause candidates behind reported field failures in semiconductors encapsulated with epoxy resins containing red phosphorus flame- retardants.

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Topics: flame retardant material, red phosphorus

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