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Understanding the Risk of Gold Flash

Posted by Craig Hillman and Randy Kong on Aug 31, 2016 11:18:28 PM

As the risk of depression fades and the electronics industry struggles to find its footing again, there must be due diligence in avoiding the same costreduction mistakes of prior generations of engineers. Examples include

Unsupported holes are just as robust as supported holes
Product qualification testing is too expensive and time consuming We don’t really need conformal coating
Can we reduce the gold thickness?

The later can be one of special concern, as the thickness of gold plating, and the quality, can play a key role in connector and interconnect reliability.

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Topics: connectors, interconnects, gold flash

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