DfR Solutions offers the following Reliability Design Review Services:
Initial Reliability Assessment (IRA) -
This reliability assessment is designed to be a rapid, low-cost review of your product/design to determine if there are any outstanding issues that could potentially influence warranty performance at the customer site. to activate this assessment, information on customer expectations of reliability (time-to-failure, warrant performance), use environment, and product design (bill or materials, Gerber files, photographic images [optional], prototype sample [optional]) must be provided. Standard turn on design reviews is 10-15 business days, depending upon product complexity.
Design for Reliability (DfR) -
This is a more comprehensive review of product reliability that combines the basics of the initial reliability assessment with the output of virtual qualification and MTBF predictions. In this situation, not only are areas of reliability improvement identified, but a comprehensive life curve is developed for the customer. For a more comprehensive reliability review, design for manufacturability and design failure mode and effects analysis are often performed in conjunction with this assessment.
Design Failure Modes and Effects Analysis (DFMEA) -
Failure Modes and Effects Analysis (FMEA) analyzes potential reliability problems early in the development cycle of a product, when it is easier to fix problems and therefore enhance overall reliability. FMEA is used to identify potential failure modes, determine their effect on the operation of the product, and identify actions to mitigate the failures. Design Failure Modes and Effects Analysis (DFMEA) focuses on components and subsystems. DfR Solutions uses DFMEA to help clients improve the quality and reliability of their design. By identifying potential issues early, DfR can provide cost-effective suggestions for solving the problems.
Virtual Qualification (VQ) -
This assessment uses physics-of-failure-based degradation models to predict time-to-failure. These models include solder joint fatigue, plated-through hole fatigue, ceramic capacitor breakdown, and next-generation integrated circuit wearout. The end result is that the customer can develop a degree of assurance that their product will survive for the desired lifetime in the expected use environment.
If you have a specific question please feel free to email us.