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Dynamic Materials Analysis (DMA)Dynamic Mechanical Analysis (DMA) is a technique used to study and characterize materials. The DMA determines changes in sample properties resulting from changes in five experimental variables:
For electronic packaging, DMA is especially useful for measuring the glass transition temperature (Tg) of laminate materials and capturing mechanical behavior, specifically stress-strain, creep, and stress relaxation, of minute structures composed of polymeric materials, such as die attach, conductive adhesives, anisotropic conductive films (AVCF), and epoxy/graphite composites. If you would like more information on DMA, please send us an email. |