System Level Effects on Solder Joint Reliability
Identify solder joint failure risks with accelerated stress tests
Poorly designed chips, substrates or other components are often blamed for system failure — but the real culprits are likely the solder joints that link them all together.
In System Level Effects on Solder Joint Reliability, experimental mechanics expert and DfR Solutions Research Engineer, Maxim Serebreni, discusses:
- Thermal fatigue, vibration and residual strains, soldering defects
- Accelerated stress tests that identify and help mitigate solder joint failure risks
- The Physics of Failure (PoF) methodology and solder alloy selection approach
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