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July 16, 2015

ESD – A Potentially Dominant Failure Mechanism Webinar

ESD – A Potentially Dominant Failure Mechanism

Presented jointly by Greg Caswell of DfR Solutions and Wolfgang Kemper of Electronic Polymers Inc.

Register Here

Electrostatic Discharge, or ESD, is a single-event, rapid transfer of electrostatic charge between two objects, usually resulting when two objects at different potentials come into direct contact with each other. ESD can also occur when a high electrostatic field develops between two objects in close proximity. ESD is one of the major causes of device failures in the semiconductor industry. Voltage suppression devices are needed in electronic systems to prevent damage to electrical components from electrical overstress (EOS) and electrostatic discharge (ESD) events. In this webinar DfR Solutions will present the issues and a methodology for defining the requirements for your application to address ESD at the component, circuit board and system levels.

Electronic Polymers Inc. will then present how a low capacitance, polymer voltage-suppressor (PVS) device is evaluated using various testing techniques that combine transmission line pulse (TLP) test system, direct discharge HBM, and a system-level ESD gun. Additionally, test methods for integrating PVS devices for system-level ESD protection of cell phone, GaAs switches for radio frequency (RF) and Gigabit Ethernet server semiconductors will be shown. EPI’s work demonstrates the need for integration of device-level and system-level test methodologies for correlation between component ESD survivability and system-level ESD concerns.

Start: July 16, 2015 11:00 am
End: July 16, 2015 12:30 pm

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July 30, 2015

Wearable Electronics Reliability Webinar

Wearable Electronics Reliability Issues and Real Life Solutions in Printed Electronics

Greg Caswell will be presenting jointly with the Engineered Materials Systems division of Nagase America

11am and 2pm sessions.

Register Here

We are fascinated by new technology. The wearable electronics market is no different. We are enamored by the futuristic outfits in Tron to the latest high tech fashion-Google glass.
But what are the real life requirements of a typical wearable electronics device? It must be non-restrictive, portable, accessible, controllable, and have both localized communication and/or wireless communications capabilities. The device needs to be able to withstand a variety of environmental, physical and usage conditions.

Does the commercial industry for wearables design for these conditions? How does this affect the consumer experience? Understanding the issues that impact wearable electronics reliability is critical to market acceptance and consumer satisfaction. During this webinar DfR Solutions will review these reliability issues and the Engineered Materials Systems division of Nagase America will provide insight into solutions for printed electronics applications.

Engineered Materials Systems has developed durable and stretchable electrically conductive inks available for the Wearable Technology and Smart Fabrics market. During this webinar, EMS will present data that shows stretch performance as developed both in-house and third party, along with existing and under development commercial applications. Compatible and enabling substrate options will be identified along with printing methods and a road map of future development needs. Wearable Technology represents unprecedented potential for Printed Electronics with numerous valued end-user applications.

Start: July 30, 2015 11:00 am
End: July 30, 2015 12:30 pm

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October 13, 2015

IWLPC Conference

Craig Hillman will be presenting a course and a paper at this conference. For more information please contact Craig Hillman.

Start: October 13, 2015
End: October 15, 2015

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October 14, 2015

IEEE Reliability Boston Chapter Meeting

Jim McLeish will be presenting on Physics of Failure at this regional event. If you would like to meet with Jim while he is in the area, please contact Mark Musitano.

Date: October 14, 2015

Event Details:

October 26, 2015

IMAPS Symposium

Greg Caswell has submitted 2 courses for consideration Understanding the Common Failure Modes from a Physics of Failure Perspective and Reliability 360, and Gil Sharon has submitted an abstract entitled “Predicting Package Level Failure Modes in Multi-Layered Packages.” If you would like to meet with Greg at the symposium, please contact Mark Musitano.

Start: October 26, 2015
End: October 29, 2015

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November 17, 2015

Electric & Hybrid Aerospace Technology Symposium

Nathan Blattau will be presenting a paper entitled “Leverage Automotive Electric/Hybrid Challenges for Success in Aerospace Technology.” If you would like to meet with Nathan at the event please contact Mark Musitano.

Start: November 17, 2015
End: November 18, 2015

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December 2, 2015

IPC Technical Education Courses – Raleigh

Dock Brown will be teaching a  course entitled “DFX: Design for Excellence DFM, DFR, DFA and More”.
In this course, learn how to effectively address increasingly sophisticated PCB fabrication technologies and methodologies. You will gain comprehensive perspective about every phase of the manufacturing process, all the way from design through to recycling phase.

Dock Brown is instructing the Fort Worth, Chicago and Raleigh courses. For more information click here.

Date: December 2, 2015

Event Details:

January 26, 2016

RAMS Conference

Jim McLeish will be teaching a course entitled “Reliability Physics-Physics of Failure Tools and Techniques” at the conference. If you would like to meet with Jim at the conference please contact Mark Musitano.

Start: January 26, 2016
End: January 28, 2016
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