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DfR Solutions has developed an expertise in the interpretation of the image produced from scanning acoustic microscopy (SAM). DfR Solutions uses SAM instrumentation to perform non-destructive failure analysis on electronics to detect delamination in die attachments, die cracking, voiding, and solderball delamination in BGA components.

SAM operates on the principles of acoustic impedance. Each material in a given sample will have different acoustic reflection and transmission coefficients Images are produced from the measured intensity of the reflected acoustic wave.

The transducer frequency range is from 2.25 to 230 MHz, allowing for a broad range of electronic parts and components to be imaged.