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About the IPC

IPC is the industry organization for the designers, manufacturers, and users of printed circuit/wiring boards and circuit card assemblies. DfR Solutions has been a member of IPC since our inception and is intimately familiar with the TM-650 and IPC-97XX test methods.

Our unique experience and expertise allow us to:

• Perform these industry-specified tests to a high degree of accuracy
• Modify the test when it no longer conforms to industry best practices
• Interpret the test results in such a way to provide a path forward for our clients (go/no-go, change lot qualification procedures, predict reliability impact, etc.)

While DfR is capable of carrying out all IPC specified testing, examples of some of the most common requests for IPC tests from our customers are displayed below.

Standards

Reliability Testing

• IPC-9701: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments.
• IPC-9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects.
• IPC-9704: IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline.
• JESD22-B113: Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products (it should be a IPC-97XX document).

Visual and Cross-Sectioning

• 2.1.1E: Microsectioning.
• 2.1.3A: Plated-Through Hole Structure Evaluation.
• 2.2.18.1: Determination of Thickness of Metallic Clad Laminates, Cross-sectional.
• 2.6.7.2B: Thermal Shock, Continuity and Microsection, Printed Board — 5/04.

Cleanliness and Contamination

• 2.3.25B: Detection and Measurement of Ionizable Surface Contaminants.
• 2.3.25.1: Ionic Cleanliness Testing of Bare PWBs.
• 2.3.26.2: Mobile Ion Content of Polymer Films.
• 2.3.27: Cleanliness Test — Residual Rosin.
• 2.3.27.1: Rosin Flux Residue Analysis-HPLC Method.
• 2.3.28A: Ionic Analysis of Circuit Boards, Ion Chromatography Method.
• 2.3.28.1: Halide Content of Soldering Fluxes and Pastes.
• 2.3.35C: Halide Content, Quantitative (Chloride and Bromide).
• 2.3.39C: Surface Organic Contaminant Identification Test (Infrared Analytical Method).
• 2.3.41: Test Method for Total Halogen Content in Base Materials.

Corrosion/Electrochemical Migration

• 2.6.3F: Moisture and Insulation Resistance, Printed Boards.
• 2.6.3.1E: Moisture and Insulation Resistance — Solder Mask.
• 2.6.3.2B: Moisture and Insulation Resistance, Flexible Base Dielectric.
• 2.6.3.3B: Surface Insulation Resistance, Fluxes.
• 2.6.3.4A: Moisture and Insulation Resistance — Conformal Coating.
• 2.6.3.5: Bare Board Cleanliness by Surface Insulation Resistance.
• 2.6.3.6: Surface Insulation Resistance — Fluxes — Telecommunications.
• 2.6.3.7: Surface Insulation Resistance.
• 2.6.13: Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring.

Board

• 2.6.14D: Resistance to Electrochemical Migration, Solder Mask.
• 2.6.14.1: Electrochemical Migration Resistance Test.
• 2.6.15C: Corrosion, Flux.
• 2.6.25: Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis.

Solder Resist (Mask) and Conformal Coatings

• 2.3.23B: Cure (Permanency) Thermally Cured Solder Mask.
• 2.3.23.1A: Cure (Permanency) UV Initiated Dry Film Solder Mask.
• 2.3.42: Solder Mask — Resistance to Solvents and Cleaning Agents.
• 2.4.23: Soldering Resistance of Laminate Materials.
• 2.4.25C: Glass Transition Temperature and Cure Factor by DSC.
• 2.4.41.2A: Coefficient of Thermal Expansion — Strain Gage Method.
• 2.4.24.2: Glass Transition Temperature of Organic Films — DMA Method.
• 2.4.24.3: Glass Transition Temperature of Organic Films — TMA Method.
• 2.4.28.1F: Adhesion, Solder Resist (Mask), Tape Test Method.
• 2.5.2A: Capacitance of Insulating Materials.
• 2.5.5.1B: Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1MHz (Contacting Electrode Systems).
• 2.5.6.1B: Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings.
• 2.5.7.1: Dielectric Withstanding Voltage — Polymeric Conformal Coating.
• 2.6.7.1: Thermal Shock — Polymer Solder Mask Coatings.
• 2.6.7.1A: Thermal Shock — Conformal Coating.
• 2.6.7.3: Thermal Shock — Solder Mask.
• 2.6.11B: Hydrolytic Stability Solder Mask and/or Conformal Coating.
• 2.6.11D: Hydrolytic Stability Solder Mask.
• 2.6.11.1: Hydrolytic Stability — Conformal Coating.

For more information on DfR’s IPC testing capabilities, please call us at 301-474-0607, or send us an email.