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About the Joint Electronic Devices Engineering Council (JEDEC)

JEDEC is the industry standards organization for semiconductor components. Thanks to its decision to make all standards and specifications free and easily available, the JEDEC documents have been widely adapted throughout the electronic component industry as the default test methodology. Among the numerous JEDEC specifications, DfR’s particular focus has been in environmental testing and quality assurance. This primarily consists of the 22A and 22B series and the recent release of tin whisker requirements.

Standards

• JESD22-A100B (superseded by JESD22-A100C): Cycled Temperature-Humidity-Bias Life Test.
• JESD22-A101B: Steady State Temperature Humidity Bias Life Test.
• JESD22-A102C: Accelerated Moisture Resistance — Unbiased Autoclave.
• JESD22-A103C: High Temperature Storage Life.
• JESD22-A104C: Temperature Cycling.
• JESD22-A105C: Power and Temperature Cycling.
• JESD22-A106B: Thermal Shock.
• JESD22-A107B: Salt Atmosphere.
• JESD22-A108C: Temperature, Bias, and Operating Life.
• JESD22-A109A: Hermeticity.
• JESD22-A110B (superseded by JESD22-A110C): Highly-Accelerated Temperature and Humidity Stress Test (HAST).
• JESD22-A111: Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices.
• JESD22-A112A (superseded by J-STD-020D.1): Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.
• JESD22-A113E (superseded by JESD22-A113F): Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing.
• JESD22-A115A: Electrostatic Discharge (ESD) Sensitivity Testing/Machine Model (MM).
• JESD22-A118: Accelerated Moisture Resistance — Unbiased HAST.
• JESD22-A119: Low Temperature Storage Life.
• JESD22-A120.01 (superseded by JESD22-A120A): Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits.
• JESD22-B101A: External Visual.
• JESD22-B102D (superseded by JESD22-B102E): Solderability.
• JESD22-B103B: Vibration/Variable Frequency.
• JESD22-B104C: Mechanical Shock.
• JESD22-B105C: Lead Integrity.
• JESD22-B106C (superseded by JESD22-B106D): Resistance to Solder Shock for Through-Hole Mounted Devices.
• JESD22-B108A: Coplanarity Test for Surface-Mount Semiconductor Devices.
• JESD22-B109 (superseded by JESD22-B109A): Flip Chip Tensile Pull.
• JESD22-B110A: Subassembly Mechanical Shock.
• JESD22-B111: Board Level Drop Test Method of Components for Handheld Electronic Products.
• JESD22-B112: High Temperature Package Warpage Measurement Methodology.
• JESD22-B113: Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products.
• JESD22-B116: Wire Bond Shear Test Method.
• JESD22-B117 (superseded by JESD22-B117A): BGA Ball Shear.
• JESD22A121.01 (superseded by JESD22A121A): Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.
• JESD201 (superseded by JESD201A): Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes.

If you would like more information regarding DfR’s JEDEC testing capabilities, please call us at 301-474-0607, or send us an email.