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DfR Solutions offers the following Mechanical Design Review services:

FEA

Mechanical FEA is one of the foundations of DfR. With over 10 years’ experience, we have modeled a wide range of mechanical structures, from solder joints under state-of-the-art electronic packages (ball grid arrays, chip scale packages, quad flat pack no-lead, stacked die, etc.), to encapsulated assemblies, to chasses containing over 20+ assemblies. In addition, our exclusive focus on electronic systems provides us a background and expertise far beyond typical FEA houses. We understand the influence of wedge lock vs. standoffs, teflon vs. FR4, random vs. sinusoidal vibration, and the behavior of solders (SnPb, SAC305, SN100C) over a range of temperatures. And we go a step further. We don’t just tell you where the “stress” is — we tell you what it means in terms of reliability and how to change your design if the lifetime does not meet your expectations.

Design for Packaging

While the focus is almost always on the functional portion of electronics, the packaging is almost always forgotten (except of course, it has to look good!). However, packaging is just as critical to your product’s success as the electrical inputs and outputs. DfR has guided numerous customers through the process of identifying the appropriate housing material, housing design, board attachments, encapsulants/coatings, and wiring and wiring harnesses through our fundamental understanding of polymers, metals, and ceramics; their cost, their manufacturability, and how they can degrade.

If you have a specific question about our Mechanical Design Review services, please feel free to email us.