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Cross sectional imaging is a key process to determine mode of failure for a myriad of problems. Samples are cut to size and potted in an epoxy resin to prevent movement of delicate features. Grinding with diamond or silicon carbide brings the point of interest to the surface, and polishing may be done with a diamond suspension, alumina slurry and/or colloidal silica to remove scratches and provide a smooth planar surface. In some cases, a chemical etch is used to discern grain boundaries and highlight some material phases over others.

Samples are imaged with an inverted light microscope during and after the grinding, polishing and etching process, with magnification up to 1000x. Brightfield, darkfield, and DIC (Differential Interference Contrast) viewing options frequently reveal defects key to discerning root cause of failure.

For more information, or if you have a specific question regarding Microsectioning, please email us.