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DfR Solutions has answers to your most perplexing problems at any stage in the product life cycle. From initial reliability assessments of new products to failure analysis of field returns, we can help you to improve the quality, reliability, and durability of your design. Here are a few projects that DfR has completed which include summaries of the problems, findings and recommendations:

Field/Customer Returns

• Elevated Leakage Current in BME Ceramic Capacitors
• Failure Analysis and Life Testing of Projection Lamps
• Failure Analysis of Circuit Card Assemblies
• Failure Analysis of a Cellular Phone
• Failure Analysis of LEDs
• Root Cause Determination of Plated Through Hole Failures
• Root-Cause Failure Analysis on Conformally Coated Control Boards
• Root-Cause Analysis of IC Field Failures
• Root-Cause Analysis of Voltage Detector
• Failure Analysis of Motor Controller in Washing Machine

Technology Insertion

• Risk Assessment of Sn-Plated Solder Terminals
• Review of Transition to Pb-Free

Design

• Analysis of Electrical Connection in a Pressure Transmitter
• Initial Reliability Assessment of a RF Electricity Meter
• Initial Assessment of Power and Driver Boards
• Design Review of Power Supply
• Resistance Reduction in Trimmed Resistors
• Initial Reliability Assessment of Humidifier Control Board
• Design Review of Heater Control
• Reliability Assessment of Residential Climate Control
• Design Review of Thermostat
• Design Review of a Pneumatic Actuator Range
• Design Review of an Uninterruptible Power Supply
• Initial Reliability Assessment of Electronic Assembly
• Initial Assessment of Outdoor Condenser Controller
• Initial Reliability Assessment of Temperature Controller
• Connector Lead Verification Study

Supply Chain

• Aluminum Liquid Electrolytic Capacitor Specification Study

Testing/Product Qualification

• Temperature-Humidity Test Specification for Solenoid Valves
• Ion Chromatography of Five Bare Boards
• Ball Grid Array Construction Analysis
• Characterization of Robustness of Ceramic Capacitors to Flex Events
• Stress Analysis and Failure Prediction of LCD Keyfob
• Review and Assessment of Accelerated Testing of Flip Chip BGA
• Investigation of Dendritic Growth over Conformal Coating
• Ceramic Capacitor Failure Investigation
• Conductive Anodic Filament (CAF) Qualification
• Consultation on Product Qualification Testing
• Physics of Failure Assessment and Test Results of Pb-Free Circuit Board
• Accelerated Testing of Backplane Board