 Our newsletter contains valuable information on a wide spectrum of electronic engineering subjects; from Pb-free and RoHS, design for reliability, and more! Subscribe to Newsletter |
|
Publications
Below is a free archive of our technical publications relevant to the electronics industry written or co-authored by DfR Solutions staff members.
2009
 |
|
Getting Product Development Right: Doing More with Less
R. Schueller, Advanced TCA Newsletter
June 2009 |
| |
 |
Second Generation Lead-free Alloys
R. Schueller, SMTA Upper Midwest Expo and Tech Forum, Bloomington, MN
June 2009 |
 |
|
Pb-Free Reflow, PCB Degradation, and the Influence of Moisture Absorption
K. O'Toole, S. Binfield, C. Hillman, and J. Beers, IPC Apex, Las Vegas, NV
April 2009 |
| |
|
Design, Manufacturing, and Reliability Challanges with QFN Part II
C. Hillman and C. Tulkoff, iMAPS/IEEE/SMTA Joint Chapter, Boston, MA
April 2009
|
|
|
Design, Manufacturing, and Reliability Challanges with QFN Part I
C. Hillman and C. Tulkoff, SMTA DC Chapter, Ashburn, VA
February 2009
|
2008
| |
|
When The Lights Go Out: LED Failure Modes and Mechanisms
J. Arnold, Electrical Source Magazine
November-December 2008 |
|
 |
Processing and Reliability Issues for Eutectic AuSn Solder Joints
IMAPS, Providence, RI
November 2008 |
|
|
Maximum Whisker Length: A New Paradigm
LEAP, Melbourne, FL
September 2008 |
|
|
A Case Study for Transitioning Class A Server Motherboards to Lead-Free
R. Schueller, W. Ables, and J. Fitch, SMTA International, August 2008. |
|
|
Robustness of Printed Wiring Boards to Pb-free Reflow and the Influence of Absorbed Moisture
SMTA International, Webcast
March 2008 |
|
|
Reliability Testing of Ni-modified SnCu and SAC305: Accelerated Thermal Cycling
J. Arnold, N. Blattau, C. Hillman, and K. Sweatman, IPC/JEDEC Lead Free Conference, March 2008. |
|
|
Reliability Testing of Ni-modified SnCu and SAC305: Vibration
J. Arnold, and K. Sweatman, IPC/JEDEC Lead Free Conference, March 2008. |
|
|
The Paradigm Shift in Design Assurance and Reliability Prediction
E. Dodd, C. Bonn, and C. Hillman, Commercialization of Military and Space Electronics, San Diego, CA
February 2008 |
|
|
How to Develop a Qualification Test Plan for RoHS Products
Reliability and Maintainability Symposium, Las Vegas, NV
January 2008 |
|
|
Developing a Pb-Free Qualification Plan for Hi-Rel Applications
G. Fischer, N. Blattau, and C. Hillman, LEAP Working Group, Irving, TX
January 2008 |
|
|
A Perspective on the Reliability of MEMS for Telecommunications
Photonics West, San Jose, CA
January 2008 |
2007
|
|
Silver and Sulfur: Case Studies, Physics, and Possible Solutions
C. Hillman, J. Arnold, S. Binfield, and J. Seppi, SMTA International, October 2007. |
|
|
Creep Corrosion on Lead-Free Printed Circuit Boards in High Sulfur Environments
R. Schueller, W. Ables, and J. Fitch, SMTA International, October 2007. |
|
|
Using Physics of Failure to Identify Root Cause of Printed Board Failure
C. Hillman, Circuitree, August 2007. |
| |
|
Whisker-Resistant Plating Usage by Major Semiconductor Manufacturers
LEAP Florida, Coral Gables, Florida
January 2007 |
| |
|
Simplified Failure Model for Pb-Free Solder
LEAP Florida, Coral Gables, Florida
January 2007 |
2006
|
|
Lead Free: Predicting and Ensuring Reliability in Military Avionics
C. Hillman, Defense Manufacturing Conference, Nashville, TN, November 2006. |
| |
|
How to be Compliant with the New GEIA/IEC Specifications for Pb-Free Products in Military Applications
Defense Manufacturing Conference, Nashville, TN, November 2006. |
|
|
Accelerated Testing of Surface Mount Solder Joints Using Printed Wiring Board Power Cycling
N. Blattau, D. Priimak, and C. Hillman, Accelerated Stress Testing & Reliability Conference, San Francisco, California, October 4-6, 2006. |
|
|
Epidemiological Study on Sn-Ag-Cu Solder: Benchmarking Results From Accelerated Life Testing
C. Hillman, N. Blattau, E. Dodd, and J. Arnold, The Surface Mount Technology Association International Conference, Chicago, Illinois, September 24, 2006. |
|
|
What I Don’t Know That I Don’t Know: Things to Worry About with the Pb-free Transition
C. Hillman and N. Blattau, Lead-Free Connection Newsletter, May 2006. |
|
|
An Engelmaier Model for Leadless Ceramic Chip Devices with Pb-free Solder
N. Blattau and C. Hillman, IPC/JEDEC Lead Free Conference, Santa Clara, California, March 7-9, 2006. |
|
|
Design Guidelines for Ceramic Capacitors Attached with SAC Solder
C. Hillman and N. Blattau, IPC/APEX, Anaheim, California, February 7-10, 2006. |
|
|
Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb
N. Blattau and C. Hillman, IPC/APEX, Anaheim, California, February 7-10, 2006. |
|
|
What I Don’t Know That I Don’t Know: Things to Worry About with the Pb-free Transition
C. Hillman, Hobbs Engineering Newsletter, January 2006. |
2005
|
|
Robustness of Surface-Mount Aluminum Electrolytic Capacitors When Subjected to Pb-free Reflow
N. Blattau, J. Wright, R. Schatz, and C. Hillman, Passive Component Industry, November/December 2005. |
|
|
Robustness of Surface Mount Multilayer Ceramic Capacitors Assembled with Pb-free Solder
N. Blattau, P. Gormally, V. Iannaccone, L. Harvilchuck, and C. Hillman, Passive Component Industry, November/December 2005. |
|
|
Assessment of Eutectic Solder Phase Growth in Under-the-hood Power Control Modules
C. Hillman, Electronic Products Magazine, September 2005. |
|
|
A Comparison of the Isothermal Fatigue Behavior of SnAgCu to SnPb Solder
N. Blattau and C. Hillman, Surface Mount Technology Association International Conference, Chicago, Illinois, September 29, 2005. |
|
|
Robustness of Surface Mount Multilayer Ceramic Capacitors Assembled with Pb-free Solder
N. Blattau, P. Gormally, V. Iannaccone, L. Harvilchuck, and C. Hillman, IEEE Components, Packaging, & Manufacturing Technology Society, July 2005. |
|
|
Failure Mechanisms in LED and Laser Diodes
M. Lee, C. Hillman, and D. Kim, Military and Aerospace Electronics website, June 2005. (View online here.) |
|
|
Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints
L.P. Lehman, R.K. Kinyanjui, J. Wang, Y. Xing, L. Zavalij, P. Borgesen, and E.J. Cotts, Electronic Components and Technology Conference, Lake Buena Vista, Florida, May 31-June 3, 2005. |
|
|
Latent Electro-static Discharge Susceptibility of Gallium Arsenide IC Devices
ASME Journal of Electronic Packaging, 2005. |
|
|
Robustness of Surface Mount Aluminum Electrolytic Capacitors When Subjected to Pb-free Reflow
C. Wiest, N. Blattau, J. Wright, R. Schatz, and C. Hillman, IPC/JEDEC 8th International Lead Free Conference on Electronic Components and Assemblies, San Jose, California, April 18-19, 2005. |
|
|
Assessment of Eutectic Solder Phase Growth in Under-the-hood Power Control Modules
C. Hillman and A. Kleyner, 2005 SAE World Congress, Detroit, Michigan, April 11-13, 2005. |
|
|
Effects of Conformal Coating on Solder Spreading Phenomenon
N. Blattau, C. Hillman, and A. Dasgupta, CMSE Commercialization of Military and Space Electronics Conference and Exhibition, Los Angeles, California, February 7-10, 2005. |
2004
|
|
Reliability of Pressure-sensitive Adhesive Tapes for Heat Sink Attachment in Air-cooled Electronic Assemblies
E. Eveloy, P. Rodgers, C. Hillman, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 4, Issue 4, pp. 650-657, December 2004. |
|
|
Improved Methodologies for Identifying Root Cause of Printed Board Failures
C. Hillman, Microelectronics Failure Analysis Desk Reference, 5th Edition, pp. 524-541, ASM International, Materials Park, OH, 2004. |
|
|
A Novel Approach to Identifying and Validating Electrical Leakage in Printed Circuit Boards through Magnetic Current Imaging
C. Hillman, 30th International Symposium for Testing and Failure Analysis, Worcester, Massachusetts, November 14-18, 2004. |
|
|
An Experimental Investigation into the Creep Behavior of Pressure Sensitive Adhesive Tapes for Air-cooled Component-Heat Sink Assemblies
V. Eveloy, P. Rodgers, and C. Hillman, 10th International Workshop on Thermal Investigations of ICs and Systems, Côte d’Azur, France, September 29-October 1, 2004. |
|
|
The Effects of Plating Materials, Bond Pad Size, and Bond Pad Geometry on Solder Ball Shear Strength
K. Rogers and C. Hillman, SMTA International 2004, Rosemount, Illinois, September 26-30, 2004. |
|
|
Environmental Aging and Deadhesion of Polyimide Dielectric Films
S. Murray, C. Hillman, and M. Pecht, ASME Journal of Electronic Packaging, Vol. 126, No. 3, pp. 390-7, September 2004. |
|
|
Linear Coefficients of Thermal Expansion of Au0.5Ni0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4
S. Pitely, L. Zavalij, S. Zarembo, and E.J. Cotts, Scripta Materialia, July 2004. |
|
|
Electrochemical Migration on HASL Plated FR-4 Printed Circuit Boards
E. Bumiller, M. Pecht, and C. Hillman, Journal of Surface Mount Technology, Vol. 17, No. 2, pp. 37-41, April-June 2004. |
|
|
Identification of Missing or Insufficient Electrolyte Constituents in Failed Aluminum Electrolytic Capacitors
C. Hillman and N. Helmold, 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29-April 1, 2004. |
|
|
Lead-free Solder and Flex Cracking Failures in Ceramic Capacitors
N. Blattau, D. Barker, and C. Hillman, 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29-April 1, 2004. |
|
|
Has the Electronics Industry Missed the Boat on Pb-free? Failures in Ceramic Capacitors with Pb-free Solder Interconnects
N. Blattau and C. Hillman, 5th International Lead Free Conference on Electronic Components and Assemblies, San Jose, California, March 18-19, 2004. |
|
|
Simulation Model Development for FBGA Solder Joint Reliability
H. Qi, M. Lee, M. Osterman, K. Lee, S. Oh, and T. Schmidt, 20th IEEE Semiconductor Thermal Measurement and Management Symposium, March 9-11, 2004. |
|
|
Thermal Assessment of Glass-Metal Composition Plasma Display Panels Using Design of Experiments
M. Lee, M. Pecht, and W. Lee, IEEE Transactions on Components and Packaging Technologies, Vol. 27, Number 1, March 2004. |
|
|
Electrochemical Migration on HASL Plated FR-4 Printed Circuit Boards
E. Bumiller, M. Pecht, and C. Hillman, Pan Pacific Conference, Maui, Hawaii, February 10-12, 2004. |
|
|
Failure Mechanisms in Electronic Products at High Altitudes
N. Blattau, D. Humphrey, and C. Hillman, 8th Annual Commercialization of Military & Space Electronics Conference, Los Angeles, California, February 9-12, 2004. |
|
|
Failure Analysis and ESD Evaluation of SiGe OpAmps
ESD/EOS Symposium, 2004. |
|
|
Electrical Characteristics and Defects of GaAs MMIC Devices Which Failed by ESD and EOS
IEEE Transactions on Device and Materials Reliability, 2004. |
2003
|
|
Application of 3D Measurement System with CCD Camera in Microelectronics
M. Lee, M. Pecht, J. Tyson, and T. Schmidt, Advanced Packaging, pp. 33-44, November 2003. |
|
|
Determining the Lifetime of Silver-filled Isotropic Conductive Adhesive (ICA)/Solder-plated Interconnections
N. Helmold, P. Iyer, and C. Hillman, IMAPS Advanced Technology Workshop on Optoelectronics Device Packaging and Materials, Bethlehem, Pennsylvania, October 2003. |
|
|
Environmental Aging and Deadhesion of Siloxane-Polyimide-Epoxy Adhesive
S. Murray, C. Hillman, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 524-531, September 2003. |
|
|
An Investigation of the Contact Resistance of a Commercial Elastomer Interconnect under Thermal and Mechanical Stresses
W. Liu, M. Lee, M. Pecht, and R. Martens, IEEE Transactions on Device and Materials Reliability, Vol. 3, Number 2, June 2003. |
|
|
Diffusion and Absorption of Corrosive Gases in Electronic Encapsulants
C. Hillman, B. Castillo, and M. Pecht, Microelectronics Reliability, Vol. 43, pp. 635-643, April 2003. |
|
|
Failures in Base Metal Electrode (BME) Capacitors
D. Donahoe and C. Hillman, 23rd Capacitor and Resistor Technology Symposium, pp. 129-133, Scottsdale, Arizona, March 31-April 3, 2003. |
|
|
Design Guidelines for Preventing Flex Cracking Failures in Ceramic Capacitors
N. Blattau, D. Barker, and C. Hillman, 2003 Proceedings — 23rd Capacitor and Resistor Technology Symposium, pp. 155-162, Scottsdale, Arizona, March 31-April 3, 2003. |
|
|
Issues in Long-term Storage of Commercial Plastic Encapsulated Microcircuits
C. Hillman and P. McCluskey, IMAPS Advanced Technology Workshop on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications, Baltimore, Maryland, March 12-14, 2003. |
|
|
Failure Analysis of Electrostatic Discharge and Electrical Overstress Failures of GaAs MMIC
Y. Hwang, M. Lee, and M. Pecht, IMAPS Advanced Technology Conference on 3-D Packaging, pp. 1-5, Baltimore, Maryland, March 11-13, 2003. |
|
|
Large-Signal Model of a Downstream DC/DC Converter for Analysis and Design of Front-End PFC Rectifier using Computer Simulation
J. Liu, T. Wilson, Jr., R. Wunderlich, R. Wong, F. Lee, Q. Zhao, and W. Dong, Applied Power Electronics Conference, Miami, Florida, February 9-13, 2003. |
|
|
Design Guidelines for Preventing Flex Cracking Failures in Ceramic Capacitors
C. Hillman, N. Blattau, and D. Barker, Global SMT and Packaging, Vol. 3, No. 1, pp. 18-21, 24, January/February 2003. |
|
|
Characterization of Some Commercial Thermally-cured Potting Materials
I. Baylakoglu, C. Hillman, and M. Pecht, International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong Kong, January 13-14, 2003. |
|
|
Growth and Selection of Intermetallic Species in Sn-Ag-Cu No-Pb Solder Systems based on Pad Metallurgies and Thermal Histories
L.P. Lehman, R.K. Kinyanjui, L. Zavalij, A. Zribi, and E.J. Cotts, Electronics Components and Technology Conference, 2003. |
2002
|
|
Characteristics of Stress Relaxation in Encapsulated Molding Compounds
M. Lee, M. Pecht, X. Huang, and S.W. Lee, The 4th International Symposium on Electronic Materials and Packaging, Vol. 4, Issue 6, pp. 37-42. December 2002. |
|
|
Thermal Characteristics of Glass-Metal Composition Plasma Display Panels
M. Lee and M. Pecht, IEEE Transactions on Advanced Packaging, Vol. 25, Issue 4, pp. 488-494, November 2002. |
|
|
Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints
Y. Zheng, C. Hillman, and P. McCluskey, American Electroplaters and Surface Finishers Society, Chicago, Illinois, June 24-27, 2002. |
|
|
Calorimetric Investigation of the Formation of Metastable Silicides in Au/a-Si Thin-film Multilayers
R.R. Chromik, L. Zavalij, M.D. Johnson, and E.J. Cotts, Journal of Applied Physics, Vol. 91, Number 11, June 2002. |
|
|
Large-Signal Model of a Downstream DC/DC Converter for Analysis and Design of Front-End PFC Rectifier using Computer Simulation
J. Liu, T. Wilson, Jr., R. Wunderlich, R. Wong, and F. Lee, Power Electronics Specialist Conference, North Queensland, Australia, June 23-27, 2002. |
|
|
A Method for Inductor Core Loss Estimation in Power Factor Correction Applications
J. Liu, T. Wilson, Jr., R. Wong, R. Wunderlich, and F. Lee, Applied Power Electronics Conference, Dallas, Texas, March 10-14, 2002. |
|
|
A Comparison of the Theory of Moisture Diffusion in Plastic Encapsulated Microelectronics with Moisture Sensor Chip and Weight-gain Measurements
H. Ardebili, C. Hillman, M. Natishan, P. McCluskey, M. Pecht, and D. Peterson, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 1, pp. 132-139, March 2002. |
|
|
Intermetallic Growth on PWBs Soldered with Sn3.8Ag0.7Cu
Y. Zheng, C. Hillman, and P. McCluskey, presented at Proceedings of the 52nd Electronic Components & Technology Conference, pp. 1226-1231, San Diego, California, 2002. |
2001
|
|
Hollow Fibers Can Accelerate Conductive Filament Formation
M. Pecht, K. Rogers, and C. Hillman, ASM International Practical Failure Analysis, Vol. 1, Issue 4, pp. 57-60, August 2001. |
|
|
A Demonstration of Virtual Qualification for the Design of Electronic Hardware
J. Cunningham, R. Valentin, C. Hillman, A. Dasgupta, and M. Osterman, ESTECH 2001, IEST, Phoenix, Arizona, April 2001. |
|
|
The Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints
A. Zribi, L. Zavalij, P. Borgesen, A. Primavera, G. Westby, and E.J. Cotts, IEEE Electronic Components and Technology Conference, 2001. |
2000
|
|
Assessing the Operating Reliability of LGA Elastomer Sockets
J. Xie, C. Hillman, P. Sandborn, M. Pecht, A. Hassanzadeh, and D. DeDonato, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 171-176, March 2000. |
|
|
Thermo-mechanical Analysis of Plasma Display Panel
IEMT/IMC Symposium, Omiya, Japan, 2000. |
1999
|
|
Thermal & Electrical Performance and Reliability Results for Cavity-Up Enhanced BGAs
T. Hayden, P. Harvey, R. Schueller, and W. Clatanoff, ECTC, Vol. 49, pp. 638-644, June 1999. |
|
|
Solder Failure Mechanisms in Single-sided Insertion-mount Printed Wiring Boards
C. Hillman, K. Rogers, A. Dasgupta, M. Pecht, R. Dusek, and B. Lorence, Circuit World, Vol. 25 (3), pp. 28-38, 1999. |
|
|
Conductive Filament Formation Failure in a Printed Circuit Board
K. Rogers, C. Hillman, M. Pecht, and S. Nachbor, Circuit World, Vol. 25 (3), pp. 6-8, 1999. |
|
|
Do You Know That Your Laminates May Contain Hollow Fibers?
K. Rogers, P.V.D. Driessche, C. Hillman, and M. Pecht, Printed Circuit Fabrication, Vol. 22. No. 4, pp. 34-38, April 1999. |
|
|
Flex Based Chip Scale Packages – Meeting the Cost/Performance Challenges
R. Schueller, E. Bradley, and P. Harvey, Chip Scale Review, January-February 1999. |
|
|
Conductive Filament Formation: A Potential Reliability Issue in Laminated Printed Circuit Cards with Hollow Fibers
M. Pecht, C. Hillman, K. Rogers, and D. Jennings, IEEE/CPMT, Vol. 22, No. 1, January 1999. |
|
|
Solder Metalization Interdiffusion in Microelectronic Interconnects
A. Zribi, R.R. Chromik, R. Presthus, J. Clum, K. Teed, L. Zavalij, J. DeVita, J. Tova, and E.J. Cotts, IEEE Electronic Components and Technology Conference, 1999. |
1998
|
|
Getting the Quality and Reliability Terminology Straight
S. Lee, A. Katz, and C. Hillman, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 3, pp. 521-523, September 1998. |
1997
|
|
Finite Element Modeling of Printed Circuit Boards for Structural Analysis
M. Lee, The First IEEE International Symposium on Polymeric Electronics Packaging, pp. 42-51, October 26-30, 1997. |
|
|
A New Enhanced Flex Based Chip Scale Package with Improved Board Level Reliability
R. Schueller, SMTA Emerging Technologies Symposium, October 1997. |
|
|
Performance and Reliability of a Cavity Down Tape BGA Package
R. Schueller, D. Aeschliman and C. Han, IEEE/EPTC Conference, October 1997. |
1996
|
|
Cracking of Laminates Subjected to Biaxial Tensile Stresses
C. Hillman, Z. Suo, and F.F. Lange, Journal of the American Ceramic Society, Vol. 79, Issue 8, August 1996. |
|
|
Crack Bifurcation in Laminar Ceramic Composites
M. Oechsner, C. Hillman, and F.F. Lange, Journal of the American Ceramic Society, Vol. 79, Issue 7, July 1996. |
|
|
Reliability Results for a Wire Bondable Tape Ball Grid Array Package
R. Schueller, Surface Mount International, March/April 1996. |
1995
|
|
Surface Cracking in Layers Under Biaxial, Residual, Compressive Stress
S. Ho, C.D. Hillman, F.F. Lange, and Z. Suo, Journal of the American Ceramic Society, Vol. 78, Issue 9, September 1995. |
|
|
Design of a Low Cost Wire Bond Tape Ball Grid Array Package
R. Schueller and A. Plepys, Surface Mount International, August 1995. |
|
|