DfR Solutions Reliability Designed and Delivered

The expert engineers and reliability professionals at DfR Solutions are thought leaders in electronics reliability. We’ve compiled a wide-range knowledge base of topics on failure. Click a category below to access whitepapers, webinars and more. 

Failure Analysis/Modes/Mechanisms

17 Equations That Changed The World - Part 1
17 Equations That Changed The World - Part 2
A Change In Paradigm: Maximum Tin Whisker Lengths Just Got Longer
A New (Better) Approach To Tin Whisker Mitigation
A New Method for Testing Electrolytic Capacitors to Compare Life Expectancy
Accelerated Aluminum Electrolytic Capacitor Life Testing
Accelerating Auto Electronics Reliability Using Physics Of Failure Modeling
Accurate Quantitative Physics-Of-Failure Approach To Integrated Circuit Reliability
Alternative Pb-Free Alloys
Automated Design Analysis: Comprehensive Modeling Of Circuit Card Assemblies
Avoid Critical Connector Failures in Challenging Environments
Best Practices in Accelerating FEA in Abaqus, Ansys, and NX Nastran
Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Best Practices in Implementing Physics of Failure into the Design Process
Best Practices in Thermal Derating
Beyond Bearing Wearout: Why Current Testing Of Fans Is Insufficient And Understanding DfR’s Solution
Circuit Analysis Success Stories
Cloud and Data Center Reliability, DfR Solutions Open House
Coatings and Pottings for Solar Panel Systems. Issues and Solutions
Common Issues With Power Supply Designs, Part 1
Common Issues With Power Supply Designs, Part 2
Condition Based Maintenance: A Predictive Approach for Electronics
Connector Design for Wearables
Contamination And Cleanliness Challenges
Copper Wire Bond Failure Mechanisms
Copper Wire Bond Failure Mechanisms (White Paper)
Creating a HALT Test Plan with Sherlock
Creep Corrosion Of Electronic Assemblies In Harsh Environments
Crossing the Chasm from ECAD to CAE
Defining Sherlock Life Cycle Environments
Derating Is NOT Always The Answer
Derating Of Schottky Diodes
Design For Reliability At The Board Level
Design For Reliability Of Electronics In Automotive Applications
Design for Reliability Best Practices
Design for Reliability With Computer Modeling
Designing And Qualifying Chip-Scale Packages
Developing a Robust Memory Strategy
Electronics Protection for Solar Panel Systems; Junction Boxes and Inverters: Issues and Challenges
Electrostatic Discharge (ESD): A Potentially Dominant Failure Mechanism
Ensuring Suitability Of Cu Wire Bonded ICs For Automotive Applications
Factors That Drive LED Reliability
Failure Analysis in Electronics
Failure Mechanisms In High Voltage PCBs
Failure Modes In Conductive Adhesives
Failure Modes Of Wearable Computers
Field Failure Early Warning System
Five Myths Of Reliability
Flex Circuit Supplier Intervention
Guarantee Reliability with Mechanical Shock Simulation
Guarantee Reliability with Potting and Coating
Guarantee Reliability with Thermal Cycling
Guarantee Reliability with Vibration Simulation and Testing
How Mitigation Techniques Affect Reliability Results For BGAs
How To Go From Concept To Customer: Best Practices In Product Delivery
How to Make the Best Flip Chip BGA in the World
Improve Thermal Derating Using Sherlock and Abaqus
Improved Efficiency & Reliability For Servers Using Immersion Cooling Technology
Improving Unmanned Aerial Vehicle (UAV) Reliability
Instability, Metastability Or Failure Of 28nm FPGA Technology
Integrated Circuit Reliability Prediction Based On Physics-Of-Failure Models In Conjunction With Field Study
Integrating Design and Reliability: The Power of Physics of Failure
Integrating Sherlock Automated Design Analysis™ software with Abaqus
Introduction to Design for Reliability
Introduction to Physics of Failure Reliability Methods
Ion Chromatography
Know Your Environment
LCD Failure Modes – It’s All About Quality
Leave No Technology Behind
LED Failures
Let It Flow
Long-Term Storage of Al E-Capacitors
Manufacturability & Reliability Challenges With Leadless Near Chip Scale (LNCSP) Packages In Pb-Free Processes
Meeting The Target Of 25 Year Reliability In Solar Electronics
Model PCBs with Greater Detail Than Ever Before
Modeling Printed Circuit Boards with Sherlock 3.2
Moisture In Hermetic Packages
My Coffee Just Killed My Computer
Next Generation Power Electronics National Manufacturing Innovation Institute
No MTBF Do You Know MTBF?
Non-Functional Pads: Should They Stay or Should They Go?
Obsolescence Management & The Impact On Reliability
Opto-Electronics: The Secret To Success
Part Quality: How to Test, When to Test, and What Does it all Mean?
Physics Of Failure
Physics Of Failure Durability Simulations Accelerate Development And Improve Reliability And Safety Of Automotive Electronics
Physics of Failure Simulation and Modeling Specifications
Predicting Component Warpage and Package Level Failure Modes
Predicting MEMS Package Level Failure Modes In Automotive Applications
Predicting Package Level Failure Modes In Multi-Layered Packages
Predicting The Reliability Of Zero-Level TSVs
Preventing CAF Formation With Reliable PCB Design
Preventing Pad Cratering During ICT
Product Reliability Alert: Red Phosphorous
Projection Lamp Failure Analysis
Qualifying For Moisture Containing Environments
Quality And Reliability Challenges For Package-On-Package
Rapid Strength Assessment Technique For AMLCDs
Reballed Ball Grid Array Reliability Under Shock And Vibration
Red Phosphorus-Induced Failures In Encapsulated Circuits
Reliability Communication: MTBF. Is There a Better Way?
Reliability Issues For Optical Transceivers
Reliability Life Cycle Maturity Model (RLCMM)
Reliability Modeling Of Electronics For Co-Designed System Applications
Reliability Modeling Software Helps Designers Get A Jump On Testing
Reliability of Next Generation ICs: CPU, GPU, and FPGAs
Reliability of Power Modules Using Sherlock
Reliability Of Thermal Batteries
Reliability of Wearable Electronics
Reliable Plated Through Hole Webinar
Reliable Plated Through Via Design And Fabrication
Reliable Plated Through-Via Design And Fabrication
Replacing MTBF/MTTF With Bx/Lx Reliability Metrics
Review Of Models For Time-To-Failure Due To Metallic Migration Mechanisms
Root Cause Analysis of HALT Failures
Select the Right Mitigation for BGAs and QFNs
Selecting Robust and Reliable Display Technologies
Sherlock 3.0 Solving Board and Product Level Vibration and Shock
Root-Cause Analysis (RCA) Of HALT Failures: Case Study
Sherlock Automated Design Analysis™ Software Parts Wizard Patterns
Sherlock: Rapid Feedback On Product Design
Shock Related Failures and Fatigue of Electronics
Slow Body Diode Failures Of Field Effect Transistors (FETs)
Solder Attachment Reliability
Solder Phase Coarsening, Fundamentals, Preparation, Measurement, And Prediction
Solving Problems of Overly Constrained Boards
Surviving the Heat Wave: Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies
Telecommunications ESD Audit
Temperature And Humidity Acceleration Factors On MLV Lifetime
Temperature Cycling and Fatigue in Electronics
Temperature Cycling And Fatigue In Electronics (White Paper)
Temperature Cycling in Electronics
Temperature Cycling of Coreless Ball Grid Arrays, DfR Solutions Open House
Temperature Dependence Of Electrical Overstress
Test Plan Development
Test Plan Development: How To Do It
The Complexities Of A Lead-Free Transition
The Next Reliability Challenge: Free Air Cooling
The Reliability of Wearable Electronics
The Reliability of Wearable Electronics, DfR Solutions Open House
The Secret to Low Cost, High Reliability Power Supplies
The Suitability of Copper Wire Bonded ICs for High Reliability/Harsh Environment Electronic Applications
The Suitability of Cu-Wire Bond ICs in Automotive and Other Harsh Environments
The Tin Myth
The Transition From MTTF Reliability Predictions To Physics Of Failure Reliability Assessments
Thermal Cycling And Fatigue
Thermal Management: How Hot Is Too Hot?
Thermo-Mechanical Reliability and the Latest Prediction Tools
Thermo-Mechanical and Mechanical Reliability of Electronics
Think Twice About That Low Tg Underfill
Tin Whiskers Assessment
TRIAC Specifications And Recommendations (Turn-On Behavior)
Understanding and Mitigating EOS and ESD in Electronics
Understanding Plated Through Via Failures
Understanding The Criticality Of Stencil Aperture Design And Implementation For A QFN Package
Understanding the Reality of New, High Reliability Solders
Uprating Of Crystal Oscillators
Uprating Of Electrolytic Capacitors
Using Physics of Failure to Improve Product Development and Reliability
Vehicle Prognostics
Wearable Electronic Medical Devices: What Fails and Why?
Wearable Electronics Reliability Challenges and Real World Solutions in Printed Electronics
Wearable Technology Design: Are You Up To The Challenge?
Wireless Reliability in the Internet of Things (IoT) World

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