DfR Solutions Reliability Designed and Delivered

The expert engineers and reliability professionals at DfR Solutions are thought leaders in electronics reliability. We’ve compiled a wide-range knowledge base of topics on manufacturing. Click a category below to access whitepapers, webinars and more. 


Manufacturing

0.3mm Pitch Chip Scale Packages: Changes And Challenges
0201 And 01005 Adoption In Industry
17 Equations That Changed The World - Part 1
17 Equations That Changed The World - Part 2
A New (Better) Approach To Tin Whisker Mitigation
A New Method for Testing Electrolytic Capacitors to Compare Life Expectancy
Are GPUs Reliable Enough for Autonomous Vehicles?
Auditing A Printed Circuit Board Fabrication Facility
Auditing Contract Manufacturing Processes
Avoid Critical Connector Failures in Challenging Environments
Best Practices For Improving The PCB Supply Chain
Best Practices For Improving The PCB Supply Chain: Performing The Process Audit
Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Beyond Bearing Wearout: Why Current Testing Of Fans Is Insufficient And Understanding DfR’s Solution
Board To Board Connections, Part 1: How To Select The Right Connection Every Time
Challenges With Package On Package (PoP): Part 1, Manufacturability
Characterization Of CEM-1 Boards
Coatings and Pottings – Issues and Challenges and the Reason for a Consortium
Coatings and Pottings for Solar Panel Systems, Issues and Solutions
Cold Plate Technology
Common Issues With Power Supply Designs, Part 1
Common Issues With Power Supply Designs, Part 2
Common Reliability Problems In Opto-Electronic Packaging: Epoxies
Conductive Anodic Filaments: The Role Of Epoxy-Glass Adhesion
Conformal Coating: Why, What, When And How
Contamination And Cleanliness Challenges
Contamination and Cleanliness: Developing Practical Responses to a Challenging Problem
Contamination Avoidance
Copper Wire Bond Failure Mechanisms
Counterfeit Detection Strategies: When And How To Do It
Counterfeit Parts: The Cost To Your Business – And How DfR Solutions Can Help
Counterfeit Testing Methodology: Minimizing Costs While Minimizing Risks
Design And Process Guidelines For QFNs: Manufacturability And Compatibility
Design for Manufacturing
Design For Reliability & Sourcing Of Printed Circuit Cards
Design For Reliability At The Board Level
Design For Reliability: PCBs
Designing And Qualifying Chip-Scale Packages
Developing a Robust Memory Strategy
Discussion On Cracking/Separation In Filled Vias
Electromagnetic Interference
Title
Electronics Protection for Solar Panel Systems; Junction Boxes and Inverters: Issues and Challenges
Electrostatic Discharge (ESD): A Potentially Dominant Failure Mechanism
Ensuring And Predicting The Reliability Of Concentrated Photovoltaic (CPV): Interconnect Structures
Ensuring Suitability Of Cu Wire Bonded ICs For Automotive Applications
Factors That Drive LED Reliability
Failure Analysis: The Right Way – Counterfeit Diode Investigation
Failure Mechanisms In High Voltage PCBs
Failure Modes In Conductive Adhesives
Failure Modes Of Wearable Computers
Field Failure Early Warning System
Five Myths Of Reliability
Gold Embrittlement In Leadfree Solder
Guarantee Reliability with Potting and Coating
Hollow Fiber Measurement Technique
How Mitigation Techniques Affect Reliability Results For BGAs
How To Build Reliable Mobile Displays
How To Go From Concept To Customer: Best Practices In Product Delivery
How to Make the Best Flip Chip BGA in the World
Impact of Process Control in Pb-Free to SnPb Reballing Techniques Part 1: Control of Thermal Exposure
Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip Devices
Improved Efficiency & Reliability For Servers Using Immersion Cooling Technology
Improved Efficiency and Reliability for Data Center Servers Using Immersion Cooling Technology
Instability, Metastability or Failure: Assessing the Reliability of 28nm FPGA Technology
Solving Problems of Overly Constrained Boards
Ion Chromatography
Keeping It Tight: Understanding Hermeticity
Know Reliability, No Counterfeits
Leave No Technology Behind
Let It Flow
Long-Term Storage of Aluminum E-Capacitors
Low Tg Underfill— The Background
Manual PCB Soldering And Cleaning Processes
Manufacturability & Reliability Challenges With Leadless Near Chip Scale (LNCSP) Packages In Pb-Free Processes
Mitigating EOS/ESD
Model PCBs with Greater Detail Than Ever Before
Modeling Printed Circuit Boards with Sherlock 3.2
Nanocoatings: The Solution to All of Our Environmental Protection Problems?
Next Generation Power Electronics National Manufacturing Innovation Institute
Non-Functional Pads (NFPs) Should They Stay or Should They Go?
Obsolescence Management & The Impact On Reliability
Opto-Electronics: The Secret To Success
Overview of Copper Pillar Technology
Practices For Improving The PCB Supply Chain
Printing Techniques For Electronics
Processing And Reliability Issues For Eutectic AuSn Solder Joints
Product Reliability Alert: Red Phosphorous
Quality And Reliability Challenges For Package-On-Package
Quantitatively Analyzing The Performance Of Integrated Circuits And Their Reliability
REACH Update
Reballing Process Controls and Cleanliness
Red Phosphorus-Induced Failures In Encapsulated Circuits
Reliability 360: How to Verify Design Robustness Early in the Process
Reliability Issues For Optical Transceivers
Reliability of Next Generation ICs: CPU, GPU, and FPGAs
Reliability of Wearable Electronics
Reliable Plated Through Hole Webinar
RoHS + Update
Select the Right Mitigation for BGAs and QFNs
Selecting Robust and Reliable Display Technologies
Solderability After Long-Term Storage
Solving Problems of Overly Constrained Boards
Temperature Cycling of Coreless Ball Grid Arrays
The Complexities Of A Lead-Free Transition
The Reliability Cycle: Understanding The Booms And Busts Of Reliability In Electronics
The Reliability of Wearable Electronics
The Reliability of Wearable Electronics, DfR Solutions Open House
The Return of the Red Retardant
The Suitability of Copper Wire Bonded ICs for High Reliability/Harsh Environment Electronic Applications
The Suitability of Cu-Wire Bond ICs in Automotive and Other Harsh Environments, DfR Solutions Open House
The Tin Myth
Thermal Uprating: The When And How
Think Twice About That Low Tg Underfill
This Is Not A Test
Understanding and Mitigating EOS and ESD in Electronics
Understanding The Criticality Of Stencil Aperture Design And Implementation For A QFN Package
Understanding the Reality of New, High Reliability Solders
Understanding The Risk Of Gold Flash
Using Nanocoatings: Opportunities & Challenges For Medical Devices
Using Physics of Failure to Improve Product Development and Reliability
Wearable Electronic Medical Devices: What Fails and Why?
Wearable Electronics Reliability Challenges and Real World Solutions in Printed Electronics
Wearable Technology Design: Are You Up To The Challenge?
Wireless Reliability in the Internet of Things (IoT) World

Materials

0.3mm Pitch Chip Scale Packages: Changes And Challenges
A New (Better) Approach To Tin Whisker Mitigation
A New Method for Testing Electrolytic Capacitors to Compare Life Expectancy
Accelerated Aluminum Electrolytic Capacitor Life Testing
Accurate Quantitative Physics-Of-Failure Approach To Integrated Circuit Reliability
Alternative Pb-Free Alloys
An Update On RoHS2
Are GPUs Reliable Enough for Autonomous Vehicles?
Autonomous Maintenance And Health Monitoring Of Rechargeable Batteries
Avoid Critical Connector Failures in Challenging Environments
Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Board To Board Connections, Part 1: How To Select The Right Connection Every Time
Bromide Free Options For Printed Circuit Boards
Capturing The Robustness Of Glass Panels In Touch-Screen Displays
Characterization Of CEM-1 Boards
Coatings and Pottings – Issues and Challenges and the Reason for a Consortium
Coatings and Pottings for Solar Panel Systems, Issues and Solutions
Common Issues With Power Supply Designs, Part 1
Common Issues With Power Supply Designs, Part 2
Common Reliability Problems In Opto-Electronic Packaging: Epoxies
Conductive Anodic Filaments: The Role Of Epoxy-Glass Adhesion
Conformal Coating: Why, What, When And How
Considerations For Selecting A PCB Surface Finish
Contamination And Cleanliness Challenges
Contamination and Cleanliness: Developing Practical Responses to a Challenging Problem
Contamination Avoidance
Copper Wire Bond Failure Mechanisms
Counterfeit Detection Strategies: When And How To Do It
Counterfeit Parts: The Cost To Your Business – And How DfR Solutions Can Help
Counterfeit Testing Methodology: Minimizing Costs While Minimizing Risks
Derating Of Schottky Diodes
Design for Manufacturing
Design For Reliability & Sourcing Of Printed Circuit Cards
Design For Reliability At The Board Level
Design For Reliability: PCBs
Developing a Robust Memory Strategy
Discussion On Cracking/Separation In Filled Vias
Electromagnetic Interference
Electronics Protection for Solar Panel Systems; Junction Boxes and Inverters: Issues and Challenges
Electrostatic Discharge (ESD): A Potentially Dominant Failure Mechanism
Ensuring And Predicting The Reliability Of Concentrated Photovoltaic (CPV): Interconnect Structures
Ensuring Suitability Of Cu Wire Bonded ICs For Automotive Applications
Factors That Drive LED Reliability
Flex Circuit Supplier Intervention
Get The Lead Out
Gold Embrittlement In Leadfree Solder
Guarantee Reliability with Mechanical Shock Simulation
Guarantee Reliability with Potting and Coating
Heatsink Optimization
Hollow Fiber Measurement Technique
How Mitigation Techniques Affect Reliability Results For BGAs
How To Build Reliable Mobile Displays
How to Make the Best Flip Chip BGA in the World
Impact of Process Control in Pb-Free to SnPb Reballing Techniques Part 1: Control of Thermal Exposure
Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip Devices
Improved Efficiency and Reliability for Data Center Servers Using Immersion Cooling Technology
Instability, Metastability Or Failure Of 28nm FPGA Technology
Instability, Metastability or Failure: Assessing the Reliability of 28nm FPGA Technology
Introduction to Design for Reliability
Ion Chromatography
Know Reliability, No Counterfeits
Know Your Environment
Leave No Technology Behind
LED Failures
Long-Term Storage of Aluminum E-Capacitors
Low Tg Underfill— The Background
Manual PCB Soldering And Cleaning Processes
Meeting The Target Of 25 Year Reliability In Solar Electronics
Mitigating EOS/ESD
Model PCBs with Greater Detail Than Ever Before
Modeling Printed Circuit Boards with Sherlock 3.2
Moisture In Hermetic Packages
My Coffee Just Killed My Computer
Nanocoatings: The Solution to All of Our Environmental Protection Problems?
Next Generation Power Electronics National Manufacturing Innovation Institute
Non-Functional Pads (NFPs) Should They Stay or Should They Go?
Non-Functional Pads (NFPs) Should They Stay or Should They Go? White Paper
Overview of Copper Pillar Technology
Part Quality: How to Test, When to Test, and What Does it all Mean?
Practices For Improving The PCB Supply Chain: Part II
Predicting Package Level Failure Modes In Multi-Layered Packages
Predicting The Reliability Of Zero-Level TSVs
Printing Techniques For Electronics
Processing And Reliability Issues For Eutectic AuSn Solder Joints
Product Reliability Alert: Red Phosphorous
Projection Lamp Failure Analysis
Rapid Strength Assessment Technique For AMLCDs
REACH Update
Reballed Ball Grid Array Reliability Under Shock And Vibration
Reballing Process Controls and Cleanliness
Red Phosphorus-Induced Failures In Encapsulated Circuits
Reliability 360: How to Verify Design Robustness Early in the Process
Reliability Issues For Optical Transceivers
Reliability of Next Generation ICs: CPU, GPU, and FPGAs
Reliability Of Thermal Batteries
Reliability of Wearable Electronics
Reliable Plated Through Hole Webinar
Review Of Models For Time-To-Failure Due To Metallic Migration Mechanisms
RoHS + Update
Select the Right Mitigation for BGAs and QFNs
Selecting Coating and Potting Material
Selecting Robust and Reliable Display Technologies
Solder Phase Coarsening, Fundamentals, Preparation, Measurement, And Prediction
Solving Problems of Overly Constrained Boards
Surviving the Heat Wave: Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies
Temperature Cycling And Fatigue In Electronics
Temperature Cycling in Electronics
Temperature Cycling of Coreless Ball Grid Arrays
Temperature Cycling Of Coreless BGAs
Test Plan Development
The Complexities Of A Lead-Free Transition
The Reliability Cycle: Understanding The Booms And Busts Of Reliability In Electronics
The Reliability of Wearable Electronics
The Reliability of Wearable Electronics, DfR Solutions Open House
The Return of the Red Retardant
The Suitability of Copper Wire Bonded ICs for High Reliability/Harsh Environment Electronic Applications
The Tin Myth
The Transition To High Brightness LEDs
Think Twice About That Low Tg Underfill
Tin Whiskers Assessment
Top 5 EMC Do’s & Don’ts
Understanding and Mitigating EOS and ESD in Electronics
Understanding Plated Through Via Failures
Understanding The Criticality Of Stencil Aperture Design And Implementation For A QFN Package
Understanding the Reality of New, High Reliability Solders
Understanding The Risk Of Gold Flash
Uprating Of Ceramic Capacitors
Uprating Of Crystal Oscillators
Uprating Of Magnetic Components
Uprating Of Plastic Axial Fans
Using Nanocoatings: Opportunities & Challenges For Medical Devices
Using Physics of Failure to Improve Product Development and Reliability
Wearable Electronic Medical Devices: What Fails and Why?
Wearable Electronics Reliability Challenges and Real World Solutions in Printed Electronics
Wearable Technology Design: Are You Up To The Challenge?
Wearables that Work: Getting it Right the First Time
Wireless Reliability in the Internet of Things (IoT) World


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