DfR Solutions Reliability Designed and Delivered

The expert engineers and reliability professionals at DfR Solutions are thought leaders in electronics reliability. We’ve compiled a wide-range knowledge base of topics on design. Click a category below to access whitepapers, webinars and more.


Design

0.3mm Pitch Chip Scale Packages: Changes And Challenges
0201 And 01005 Adoption In Industry
17 Equations That Changed The World - Part 1
17 Equations That Changed The World - Part 2
A Change In Paradigm: Maximum Tin Whisker Lengths Just Got Longer
A New (Better) Approach To Tin Whisker Mitigation
Alternative Pb-Free Alloys
Autonomous Maintenance And Health Monitoring Of Rechargeable Batteries
Avoid Critical Connector Failures in Challenging Environments
Best Practices For Motherboard / Embedded System Design
Best Practices in Accelerating FEA in Abaqus, Ansys, and NX Nastran
Best Practices in Avoiding Pad Cratering and Capacitor Cracking
Best Practices in Implementing Physics of Failure into the Design Process
Beyond Bearing Wearout: Why Current Testing Of Fans Is Insufficient And Understanding DfR’s Solution
Board To Board Connections: How To Select The Right Connection Every Time (PDF)
Bromide Free Options For Printed Circuit Boards
Capturing The Robustness Of Glass Panels In Touch-Screen Displays
Challenges With Package On Package (PoP): Part 1, Manufacturability
Circuit Analysis Success Stories
Coatings and Pottings for Solar Panel Systems: Issues and Solutions
Cold Plate Technology
Common Issues With Power Supply Designs, Part 1
Common Issues With Power Supply Designs, Part 2
Common Mistakes in Embedded System Designers
Common Reliability Problems In Opto-Electronic Packaging: Epoxies
Conductive Anodic Filaments: The Role Of Epoxy-Glass Adhesion
Conformal Coating: Why, What, When And How
Connector Design for Wearables
Copper Wire Bond Failure Mechanisms
Counterfeit Detection Strategies: When And How To Do It
Counterfeit Parts: The Cost To Your Business – And How DfR Solutions Can Help
Counterfeit Testing Methodology: Minimizing Costs While Minimizing Risks
Creep Corrosion Of Electronic Assemblies In Harsh Environments
Derating Of Schottky Diodes
Design And Process Guidelines For QFNs: Manufacturability And Compatibility
Design For Reliability At The Board Level
Designing And Qualifying Chip-Scale Packages
Developing a Robust Memory Strategy
Electrostatic Discharge (ESD): A Potentially Dominant Failure Mechanism
Ensuring And Predicting The Reliability Of Concentrated Photovoltaic (CPV): Interconnect Structures
Five Myths Of Reliability
Guarantee Reliability with Mechanical Shock Simulation
Guarantee Reliability with Thermal Cycling
Guarantee Reliability with Vibration Simulation and Testing
Heatsink Optimization
How Mitigation Techniques Affect Reliability Results For BGAs
How To Build Reliable Mobile Displays
How To Go From Concept To Customer: Best Practices In Product Delivery
Improved Efficiency & Reliability For Servers Using Immersion Cooling Technology
Integrating Design and Reliability: The Power of Physics of Failure
Introduction to Design for Reliability
Introduction To Japanese Style Mizenboushi Methods
Ion Chromatography
Keeping It Tight: Understanding Hermeticity
Know Reliability, No Counterfeits
Leave No Technology Behind
LED Failures
Manufacturability & Reliability Challenges With Leadless Near Chip Scale (LNCSP) Packages In Pb-Free Processes
My Coffee Just Killed My Computer
Non-Functional Pads (NFPs) Should They Stay or Should They Go? (Presentation)
Non-Functional Pads (NFPs) Should They Stay or Should They Go? (White Paper)
Overview of Copper Pillar Technology
Predicting MEMS Package Level Failure Modes In Automotive Applications
Predicting Package Level Failure Modes In Multi-Layered Packages
Predicting The Reliability Of Zero-Level TSVs
Preventing CAF Formation With Reliable PCB Design
Product Reliability Alert: Red Phosphorous
Projection Lamp Failure Analysis
Quality And Reliability Challenges For Package-On-Package
Red Phosphorus-Induced Failures In Encapsulated Circuits
Reliability Issues For Optical Transceivers
Reliability Modeling Of Electronics For Co-Designed System Applications
Reliability Of Thermal Batteries
Reliable Plated Through Hole Webinar
Reliable Plated Through-Via Design And Fabrication
RoHS + Update
Selecting Robust and Reliable Display Technologies
Sherlock: Rapid Feedback On Product Design
Sherlock 5.0's Features
Slow Body Diode Failures Of Field Effect Transistors (FETs)
Surviving the Heat Wave: Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies
Temperature Cycling Of Coreless BGAs
Test Plan Development
The Reliability of Wearable Electronics
The Secret to Low Cost, High Reliability Power Supplies
The Tin Myth
The Transition To High Brightness LEDs
Thermal Cycling And Fatigue
Thermal Management: How Hot Is Too Hot?
Think Twice About That Low Tg Underfill
This Is Not A Test
Tin Whiskers Assessment
Top 5 EMC Do’s & Don’ts
TRIAC Specifications And Recommendations (Turn-On Behavior)
Understanding and Mitigating EOS and ESD in Electronics
Understanding Plated Through Via Failures
Understanding The Risk Of Gold Flash
Uprating Of Ceramic Capacitors
Uprating Of Crystal Oscillators
Uprating Of Electrolytic Capacitors
Uprating Of Magnetic Components
Uprating Of Plastic Axial Fans
Wearable Technology Design: Are You Up To The Challenge?
Wireless Reliability in the Internet of Things (IoT) World
You Can Not Pass Or Fail HALT

Design for Reliability

17 Equations That Changed The World - Part 1
17 Equations That Changed The World - Part 2
Accelerating Auto Electronics Reliability Using Physics Of Failure Modeling
Are GPUs Reliable Enough for Autonomous Vehicles?
Automated Design Analysis: Comprehensive Modeling Of Circuit Card Assemblies
Best Practices in Implementing Physics of Failure into the Design Process
Bridging the Gap from ECAD to CAE
Challenges With Package On Package (PoP): Part 1, Manufacturability
Cold Plate Technology
Contamination Avoidance
Derating Is NOT Always The Answer
Design For Manufacturing
Design For Reliability & Sourcing Of Printed Circuit Cards
Design for Reliability at the Board Level
Design For Reliability Of Electronics In Automotive Applications
Design For Reliability With Computer Modeling
Design for Reliability Best Practices
Design For Reliability: PCBs
DfR Solutions: Your Partner Throughout The Product Life Cycle
Electromagnetic Interference
Guarantee Reliability with Potting and Coating
Guarantee Reliability with Thermal Cycling
Guarantee Reliability with Vibration Simulation and Testing
HALT and Sherlock Automated Design Analysis™ Software
How Sherlock Can Help You, Now and Into the Future
Integrating Design and Reliability: The Power of Physics of Failure
Introduction to Design for Reliability
Introduction to Physics of Failure Reliability Methods
LCD Failure Modes – It’s All About Quality
Learn about Automated Design Analysis with Greg Caswell
Manufacturability & Reliability Challenges With Leadless Near Chip Scale (LNCSP) Packages In Pb-Free Processes
Meeting The Target Of 25 Year Reliability In Solar Electronics
Mitigating EOS/ESD in Electronics
Model PCBs with Greater Detail Than Ever Before
Modeling and Simulation of Electronics
Overview Of New DoD Reliability Revitalization Initiatives & MIL-HDBK-217 Update Efforts
Physics of Failure Simulation and Modeling Specifications
Predicting MEMS Package Level Failure Modes In Automotive Applications
Rapid and Definitive Simulation of Next Generation Electronics
Reliability 360: How to Verify Design Robustness Early in the Process
Reliability Life Cycle Maturity Model (RLCMM)
RoHS + Update
Selecting Coating and Potting Material
Selecting Robust and Reliable Display Technologies
Slow Body Diode Failures Of Field Effect Transistors (FETs)
Solder Attachment Reliability
Solving Problems of Overly Constrained Boards
The Reliability of Wearable Electronics
The Reliability of Wearable Electronics, DfR Solutions Open House
The Secret to Low Cost, High Reliability Power Supplies
The Year of Design, Craig Hillman
This Is Not A Test
Upgrading The Component Derating Process
Using Physics of Failure to Improve Product Development and Reliability
Wearable Electronics Reliability Challenges and Real World Solutions in Printed Electronics
Wearable Technology Design: Are You Up To The Challenge?
Your Partner Throughout the Product Development Life-cycle


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