Reduce Electronic Failures With Thermal Cycling
The majority of electronic failures are thermo-mechanically related.
Guaranteeing Reliability with Thermal Cycling explores the causes of – and solutions to – thermally induced stresses and strains, including:
- Fatigue in plated through holes and solder joints
- Board property influences
- Excessive differences in coefficient of thermal expansion
- Materials modeling
Watch the Guaranteeing Reliability with Thermal Cycling webinar now by completing the form.