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Reduce Electronic Failures With Thermal Cycling

The majority of electronic failures are thermo-mechanically related.

Guaranteeing Reliability with Thermal Cycling explores the causes of – and solutions to – thermally induced stresses and strains, including:

  • Fatigue in plated through holes and solder joints
  • Board property influences
  • Excessive differences in coefficient of thermal expansion
  • Materials modeling

Watch the Guaranteeing Reliability with Thermal Cycling webinar now by completing the form.