Avoid Assembly Failure Caused By Shock Or Drop

Mechanical overloads generated during a shock/drop event produce unpredictable overstress failures.

In Investigating Shock Related Failures of Electronic Assemblies you’ll find details on how reliability testing and analysis can detect the consequences of – and reveal solutions for – shock/drop event failure, including:

  • Pad catering
  • Intermetallic fracture
  • Interconnect fracture 

Watch our Investigating Shock Related Failures of Electronic Assemblies webinar now by completing the form.