Avoid Assembly Failure Caused By Shock Or Drop
Mechanical overloads generated during a shock/drop event produce unpredictable overstress failures.
In Investigating Shock Related Failures of Electronic Assemblies you’ll find details on how reliability testing and analysis can detect the consequences of – and reveal solutions for – shock/drop event failure, including:
- Pad catering
- Intermetallic fracture
- Interconnect fracture
Watch our Investigating Shock Related Failures of Electronic Assemblies webinar now by completing the form.