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Predicting MEMS Package Level Failure Modes in Automotive Applications

Use physics of failure to optimize MEMS reliability and durability

Micro Electro-Mechanical Systems (MEMS) are increasingly being used to monitor and control safety critical vehicle systems, making ensuring their reliability and durability a top priority.

“Predicting MEMS Package Level Failure Modes in Automotive Applications” explores how physics of failure and Sherlock Automated Design Analysis™ software:

  • Evaluates susceptibilities in MEMS failure modes, including Coefficient of Thermal Expansion (CTE) copper mismatch, filled microvia delamination and cracking stresses
  • Creates a high-fidelity model and performs Physics of Failure (PoF) analysis of a MEMS device design to accurately assess and achieve functional safety levels of reliability and durability
  • Assures compliance with stringent ISO-26262 Vehicle System Functional Safety requirements
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