Mitigation-of-QFN-and-BGA-Packaging-webinar.jpg

Select the Right Mitigation for BGAs and QFNs

Application-driven choices reduce PCB reliability risks

Ball grid array (BGA) and quad flat pack no-lead (QFN) are the preferred packaging choices for most integrated circuit devices, but they present a greater potential for lead-free solder joint failure through thermal cycling, vibration and mechanical shock. Can the risk be properly mitigated?

Find out in our Select the Right Mitigation for BGAs and QFNs webinar. It explores:

  • Component corner staking, edge bonding and underfill
  • Operating conditions that impact mitigation
  • Testing results based on a variety of solders and mitigation techniques
  • Application-driven mitigation choices

Access the webinar now by completing the form.