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Ensuring Stability of Copper Wire Bonded ICs for Automotive Applications

Mitigate risk and improve reliability with Physics of Failure

Semiconductor component wire bonds are transitioning from gold to copper – a smart economic move, but what does it mean for automotive application reliability? 

This Suitability of Copper Wire Bonded ICs for Harsh Environment Electronic Applications webinar takes an in-depth look at the impact of Cu-WBs and how mitigating potential failure risks using Physics of Failure (PoF) maintains:

  • Quality, reliability and durability (QRD)
  • Automotive E/E integrity
  • Safety, especially in harsh automotive environments
  • Product reliability and consumer expectations surrounding it

 Complete the form to access your free copy of this valuable webinar.