ServicesBanner

Test Standards

DfR Solutions staff understand all industry test specifications so well that we are also very much aware of their limitations. This awareness places us at the forefront of the test industry, as we provide and go beyond common industry test specifications. As a result, we can provide you with solutions that can assure your product’s longevity. Find out more about our experience in testing components to industry specifications by reviewing the following list.

Automotive Electronics Council (AEC)

Q100-001 WireBond Shear Test
Q100-002 Human Body Model Electrostatic Discharge Test
Q100-003 Machine Model Electrostatic Discharge Test
Q100-004 IC Latch-Up Test
Q100-005 Non-Volatile Memory Program/Erase Endurance, Data Retention
Q100-006 Electro-Thermally Induced Parasitic Gate Leakage Test
Q100-009 Electrical Distribution Assessment
Q100-010 Solder Ball Shear Test
Q100-011 Charged Device Model Electrostatic Discharge Test
Q100-012 Short Circuit Reliability Characterization of Smart Power Devices for 12V
Q101-001 Human Body Model Electrostatic Discharge Test
Q101-002 Machine Model Electrostatic Discharge Test
Q101-003 Wire Bond Shear Test
Q101-004 Miscellaneous Test Methods
Q101-005 Charged Device Model Electrostatic Discharge Test
Q101-006 Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems
Q200-001 Flame Retardance Test
Q200-002 Human Body Model Electrostatic Discharge Test
Q200-003 Beam Load (Break Strength) Test
Q200-004 Measurement Procedures for Resettable Fuses
Q200-005 Board Flex / Terminal Bond Strength Test
Q200-006 Terminal Strength (SMD) / Shear Stress Test
Q200-007 Voltage Surge Test
AEC-Q005 Pb-Free Test Requirements
AEC-CDC Certificate of Design, Construction and Qualification

JEDEC

JESD22-A108 High Temperature Forward Bias
JESD22-A108 High Temperature Operating Life
JESD22-A108 Low Temperature Operating Life
JESD22-A108 High Temperature Reverse Bias
JESD22-A108 High Temperature Gate Bias
JESD22-A103 High Temperature Storage Life
JESD22-A117 Non-Volatile Memory Cycling Endurance
JESD22-A117 Data Retention for Non-Volatile Memory: High Temp
JESD22-A117 Non-Volatile Memory Low-Temperature Retention and Read Disturb
JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
JESD22-A103 High Temperature Storage Life
JESD22-A101 Steady State Temperature Humidity Bias Life Test
JESD22-A100 Cycled Temperature-Humidity-Bias Life Test
JESD22-A110 Highly Accelerated Temperature and Humidity Stress Test (HAST)
JESD22-A104 Temperature Cycling
JESD22-A118 Accelerated Moisture Resistance – Unbiased HAST
JESD22-A102 Accelerated Moisture Resistance – Unbiased Autoclave
JESD78 IC Latch-Up Test
JESD86 Electrical Parameters Assessment
JDS-001-2012 Electrostatic Discharge Sensitivity Testing
Human Body Model Component Level
JESD22-C101 Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
JESD22-B117 Solder Ball Shear
JESD22-B116 Wire Bond Shear Test Method
JESD22-B102 Solderability
JESD22-B115 Solder Ball Pull
JESD22-A121 Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
JESD201 Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
JESD22-A104 Temperature Cycling
JESD22-B116 Wire Bond Shear Test Method
JESD22-B102 Solderability
JESD22-B117 Solder Ball Shear
JESD22-B104 Mechanical Shock
JESD22-B103 Vibration, Variable Frequency
MIL-STD-883 M2001 Constant Acceleration
JESD22-A109 Hermeticity – Fine Leak Test
JESD22-A109 Hermeticity – Gross Leak Test
JESD22-A121 Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes

IPC-970X series

Military Component Test Methods

MIL-STD-883 M2009 External Visual
MIL-STD-883 M2016 Physical Dimensions
MIL-STD-883 M2004 Lead Integrity
MIL-STD-883 M2024 Lid Torque for Glass-Frit-Sealed Packages
MIL-STD-883 M1018 Internal Gas Analysis
MIL-STD-883 M1001 Barometric Pressure, Reduced (Altitude Operation)
MIL-STD-883 M1002 Immersion
MIL-STD-883 M1003 Insulation Resistance
MIL-STD-883 M1004 Moisture Resistance
MIL-STD-883 M1005 Steady State Life
MIL-STD-883 M1006 Intermittent Life
MIL-STD-883 M1007 Agree Life
MIL-STD-883 M1008 Stabilization Bake
MIL-STD-883 M1009 Salt Atmosphere (Corrosion)
MIL-STD-883 M1010 Temperature Cycling
MIL-STD-883 M1011 Thermal Shock
MIL-STD-883 M1012 Thermal Characteristics
MIL-STD-883 M1013 Dew Point
MIL-STD-883 M1014 Seal
MIL-STD-883 M1015 Burn-in Test
MIL-STD-883 M1016 Life/Reliability Characterization Tests
MIL-STD-883 M1017 Neutron Irradiation
MIL-STD-883 M1018 Internal Gas Analysis
MIL-STD-883 M1019 Ionizing Radiation (Total Dose) Test Procedure
MIL-STD-883 M1020 Dose Rate Induced Latch-up Test Procedure
MIL-STD-883 M1021 Dose Rate Upset Testing of Digital Microcircuits
MIL-STD-883 M1022 MOSFET Threshold Voltage
MIL-STD-883 M1023 Dose Rate Response of Linear Microcircuits
MIL-STD-883 M1030 Pre-Seal Burn-in
MIL-STD-883 M1031 Thin Film Corrosion Test
MIL-STD-883 M1032 Package Induced Soft Error Test Procedure (Due to Alpha Particles)
MIL-STD-883 M1033 Endurance Life Test
MIL-STD-883 M1034 Die Penetrant Test (for Plastic Devices)
MIL-STD-883 M2001 Constant Acceleration
MIL-STD-883 M2002 Mechanical Shock
MIL-STD-883 M2003 Solderability
MIL-STD-883 M2004 Lead Integrity
MIL-STD-883 M2005 Vibration Fatigue
MIL-STD-883 M2006 Vibration Noise
MIL-STD-883 M2007 Vibration, Variable Frequency
MIL-STD-883 M2008 Visual and Mechanical
MIL-STD-883 M2009 External Visual
MIL-STD-883 M2010 Internal Visual (Monolithic)
MIL-STD-883 M2011 Bond Strength (Destructive Bond Pull Test)
MIL-STD-883 M2012 Radiography
MIL-STD-883 M2013 Internal Visual Inspection for Destructive Physical Analysis
MIL-STD-883 M2014 Internal Visual and Mechanical
MIL-STD-883 M2015 Resistance to Solvents
MIL-STD-883 M2016 Physical Dimensions
MIL-STD-883 M2017 Internal Visual (Hybrid)
MIL-STD-883 M2018 Scanning Electron Microscope Inspection of Metallization
MIL-STD-883 M2019 Die Shear Strength
MIL-STD-883 M2020 Particle Impact Noise Detection Test
MIL-STD-883 M2021 Glassivation Layer Integrity
MIL-STD-883 M2022 Wetting Balance Solderability
MIL-STD-883 M2023 Nondestructive Bond Pull
MIL-STD-883 M2024 Lid Torque for Glass-Frit-Sealed Packages
MIL-STD-883 M2025 Adhesion of Lead Finish
MIL-STD-883 M2026 Random Vibration
MIL-STD-883 M2027 Substrate Attach Strength
MIL-STD-883 M2028 Pin Grid Package Destructive Lead Pull Test
MIL-STD-883 M2029 Ceramic Chip Carrier Bond Strength
MIL-STD-883 M2030 Ultrasonic Inspection of Die Attach
MIL-STD-883 M2031 Flip Chip Pull-Off Test
MIL-STD-883 M2032 Visual Inspection of Passive Elements
MIL-STD-883 M2035 Ultrasonic Inspection of TAB Bonds
MIL-STD-883 M2036 Resistance to Soldering Heat
MIL-STD-883 M5003 Failure Analysis Procedures for Microcircuits
MIL-STD-883 M5004 Screening Procedures
MIL-STD-883 M5005 Qualification and Quality Conformance Procedures
MIL-STD-883 M5007 Wafer Lot Acceptance
MIL-STD-883 M5009 Destructive Physical Analysis
MIL-STD-883 M5010 Test Procedures for Custom Monolithic Microcircuits
MIL-STD-883 M5011 Evaluation and Acceptance Procedures for Polymeric Adhesives
MIL-STD-883 M5013 Wafer Fabrication Control and Wafer Acceptance Procedures for Processed GaAs Wafers