DfR Solutions Reliability Designed and Delivered

RAMS

Date: 01/23/17

Location: Orlando, FL

DfR Solutions will be at The Annual Reliability and Maintainability Symposium January 23-26 at the Rosen Plaza Hotel in Orlando, FL. Stop by booth 105 or contact Ed Dodd if you'd like to meet at the conference.

Event Year: 2017

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Implementing Physics of Failure into the Design Process Seminar

Date: 01/25/17

Location: Eindhoven, Netherlands

DfR Solutions has partnered with InnoFour to bring you the free seminar, “Implementing Physics of Failure into the Design Process.” On January 25, 2017 at High Tech Campus Eindhoven, Dr. Craig Hillman, Chief Executive Officer of DfR Solutions, will introduce you to how PCB reliability analysis challenges are solved by using Physics of Failure (PoF) with Sherlock Automated Design Analysis™ software.

For more details and the full agenda, click here

Register for this great opportunity to hear and learn from Dr. Craig Hillman, an expert in Physics of Failure.

Event Year: 2017

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MRQW Meeting

Date: 02/07/17

Location: El Segundo, CA

On February 7 & 8, The 2017 Microelectronics Reliability & Qualification Working Meeting will be held at The Aerospace Corporation in El Segundo, CA along with a welcome reception at 5:30 p.m., February 7, at the Ayres Hotel in Hawthorne, CA. At this conference which highlights reliability and qualification issues for microelectronics targeted for use in space systems, Craig Hillman will be presenting a paper entitled “Performing Semiconductor Wearout Predictions for State-of-the-Art Integrated Circuits: A Status Update.”  If you would like to meet with Craig while he is in the area, please contact Mark Musitano at mmusitano@dfrsolutions.com.

Event Year: 2017

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IEEE Santa Clara Valley Reliability Chapter Meeting

Date: 02/09/17

Location: San Jose, CA

On February 9, DfR Solutions' CEO and Managing Parter Craig Hillman will be the featured speaker at the February IEEE Santa Clara Valley Reliability Chapter Meeting.

He will be presenting on Copper Pillar, ELK, and Solder: The Challenges of Assembly and Long-Term Reliability at 28nm and 16nm. As always, manufacturing and performance take the forefront in regards to semiconductor packaging. The introduction of copper pillar has helped increase the number of I/O’s and current density. The increasing use of ELK and ULK, especially at higher metal layers, has allowed for lower RC constants and better performance. However, both of these changes can come at a cost. A number of companies are reporting challenges with these new structures, especially at 28nm and 16nm process nodes. This presentation will review the current status of copper pillar and ELK, the potential risks both introduce into assembly and long-term reliability, and avenues to evaluate and mitigate any life-limiting mechanisms. 

Event Year: 2017

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2017 Silicon Valley Reliability Symposium

Date: 02/09/17

Location: Santa Clara, CA

DfR Solutions and Ops A La Carte are hosting a free symposium on electronics design reliability. Join us on Thursday, February 9th, 2017 at the Biltmore Hotel and Suites located at 2151 Laurelwood Rd, Santa Clara, CA from 8 am to noon for insightful presentations on reliability topics that will empower you to design better, more reliable products, faster and more cost effectively than ever before. Whether you are developing products for the IoT, Wearables, Consumer, or other innovative markets, this conference is for you.

Event Year: 2017

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IPC APEX 2017

Date: 02/11/17

Location: San Diego, CA

Dock Brown will be presenting a paper on “MLCC Oxygen Vacancy Migration” and a half day tutorial on DfX. For more information or to meet with Dock at the conference, please contact Dock Brown. Also Craig Hillman and Maxim Serebreni will be presenting “Effect of Underfill Material on Tensile Stress During Thermo-Mechanical Cycling of Pb-free Solder Joints.” For more information or to meet with Craig at the conference please contact Craig Hillman.

Event Year: 2017

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IMAPS Device Packaging Conference

Date: 03/06/17

Location: Fountain Hills, AZ

Greg Caswell has submitted an abstract entitled “Surviving the Heat Wave – A Presentation on Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies.” For more information, please contact Greg Caswell.

Event Year: 2017

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2017 Design for Reliability Conference: Implementing Physics of Failure in Electronic Products and Systems

Date: 03/20/17

Location: Baltimore, MD

On Monday, March 20, DfR Solutions is hosting the 2017 Design for Reliability Conference: Implementing Physics of Failure (PoF) in Electronic Products and Systems and registration is open now! The full day conference will take place at the Sheraton Inner Harbor (special room rates are available for conference and training attendees).

Event Year: 2017

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2017 Sherlock Technical Training

Date: 03/21/17

Location: Baltimore, MD

DfR Solutions is offering 2017 Sherlock Technical Training for Sherlock users on Tuesday, March 21 and Wednesday, March 22, after the 2017 Design for Reliability Conference. Training will be held at the Sheraton Inner Harbor with special room rates are available for conference and training attendees. Increase your Sherlock user skills, learn more about critical features and earn a Sherlock User Certificate. We offer two levels of training to our Sherlock Automated Design Analysis™ software users: intermediate and advanced.

Event Year: 2017

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EuroSimE 2017

Date: 04/02/17

Location: Dresden, Germany

Craig Hillman will be the Industrial Keynote presenter at the conference. His topic will be Reliability Calculations in Semiconductors - a Short History of Accomplishments. If you would like to meet with Craig at the conference please contact Mark Musitano.

Event Year: 2017

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