Upcoming Events

In his role as vice-chair, Walt Tomczykowski will be helping this industry-governmental body understand how to respond to recent counterfeit legislation.

Greg Caswell will be visiting companies in Connecticut and is available to discuss TSV technology, LEDs, MEMS packaging, and benchmarking your supply chain. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

Walt Tomczykowski will be visiting companies in Southern California and is available to discuss counterfeits, obsolescence, physics of failure, system-level reliability and total lifecycle management. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

will be making a presentation at the Applied Power Electronics Conference. His presentation will be on "Using Physics and Industry Best Practices to Predict the Lifetime of LED Power Supplies." For more information contact Craig Hillman.

Cheryl Tulkoff will be making a presentation entitled "Advances and Challenges in High Temperature Component Attachment" at this local chapter meeting. For more information contact Cheryl Tulkoff.

Cheryl Tulkoff will be visiting companies in the Houston area and is available to discuss DfM, root-cause analysis, and product qualification testing. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

Craig Hillman will be visiting companies in the Pittsburgh area and is available to discuss DfR, component packaging, and Pb-free reliability. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

Abstract: Physics of Failure (also known as Reliability Physics) is a science-based approach for achieving Reliability by Design. The approach is based on research to identify and understand the processes that initiate and propagate mechanisms that ultimately results in failure. This knowledge when used in Computer Aided Engineering (CAE) durability simulations and reliability assessment can evaluate if a new design, under actual operating is susceptible to the root causes of failure such as fatigue, fracture, wear, and corrosion during the intended service life of the product.

In this webinar, you will:

• Compare classic reliability concepts to the PoF approach
• Identify and eliminate potential failure mechanisms
• Estimate product life under actual operating or test conditions
• Learn how to implement a Physics of Failure methodology for your products

Greg Caswell will be making a presentation on "Challenges with Package on Package (PoP)" at this local chapter meeting of IMAPS/SMTA and IPC members. For more information contact Greg Caswell.

Cheryl Tulkoff will be teaching her highly regarded course on Design for Manufacturability on Sunday, Feb 26th, in addition Cheryl will be moderating these 2 sessions at APEX 2012.

• S19 - Wednesday, February 29, 10:15am-11:45am - PCB Hole Fill
• S31 - Thursday, March 1, 10:15am-11:45am - Pad Cratering

If you would like to meet up with Cheryl at IPC APEX, please contact June Caswell.

Cheryl Tulkoff will be visiting companies in the San Diego area and is available to discuss DfM, root-cause analysis, and product qualification testing. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

Greg Caswell will be making a presentation at the DPC entitled, "Predicting the Reliability of Zero-Level TSVs." For more information contact Greg Caswell.

Greg Caswell will be visiting companies in Arizona and is available to discuss TSV technology, LEDs, MEMS packaging, and benchmarking your supply chain. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

Ed Wyrwas will be visiting companies in the Bay Area and is available to discuss integrated circuit reliability at 45nm and below and solid state drive performance. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

Ed Wyrwas will be making a presentation at this conference focusing on "Addressing the Reliability of Silicon Systems using Physics of Failure." For more information contact Ed Wyrwas.

DfR will be hosting another open house at our facility on the 19th. We will have four (4) technical presentations by deep subject matter experts, a tour of DfR's facility and a demonstration of DfR's Automated Design Analysis software-Sherlock. For more information, contact Tammy Smittenaar.

Randy Schueller will be visiting companies in the Bay Area and is available to discuss material selection, Pb-free mitigation strategies, and the latest printed board technologies. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

Randy Schueller will be making a presentation entitled "Reliability Modeling of Electronics for Solar Inverters" at this new conference. For more information, contact Randy Schueller.

Walt Tomczykowski will be presenting Using Physics of Failure Based Software to Predict Remaining Avionics PCBA Life. In addition, Walt and Tom O'Connor will be manning the DfR booth in the exhibit area. Be sure to stop by and visit with them. For more information contact Walt Tomczykowski.

Cheryl Tulkoff will be presenting "Pad Cratering and Pb-Free" during these webinars. For more information or to register, please visit the SMTA website.

Cheryl Tulkoff will be presenting "Pad Cratering and Pb-Free" during these webinars. For more information or to register, please visit the SMTA website.

Walt Tomczykowski and Craig Hillman will be attending this critical industry conference and presenting case studies on how DfR's Sherlock software could have been used to avoid or mitigate many of the issues identified and discussed by the conference attendees.

Cheryl Tulkoff will be visiting companies in Germany and is available to discuss DfM, root-cause analysis, and product qualification testing. If you and your associates are interested in an onsite visit and/or presentation, please contact June Caswell.

Cheryl Tulkoff will be presenting two half-day tutorials at this conference. The first will be "Design for Reliability" on May 8. The second tutorial will be "Sourcing of Printed Circuit Boards" on May 10. For more information, please contact June Caswell.

Greg Caswell will be presenting "The Effect of Coating and Potting on the Reliability of QFN Devices." For more information, please contact June Caswell.