Join us at the 2017 Design for Reliability Conference - Monday, March 20th | Baltimore, MD
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DfR Solutions Reliability Designed and Delivered

IMAPS Device Packaging Conference

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Location: Fountain Hills, AZ

Greg Caswell has submitted an abstract entitled “Surviving the Heat Wave – A Presentation on Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies.” For more information, please contact Greg Caswell.

Topics: 2017