Join us at the 2017 Design for Reliability Conference - Monday, March 20th | Baltimore, MD
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DfR Solutions Reliability Designed and Delivered

MRQW Meeting

Date: 02/07/17

Location: El Segundo, CA

On February 7 & 8, The 2017 Microelectronics Reliability & Qualification Working Meeting will be held at The Aerospace Corporation in El Segundo, CA along with a welcome reception at 5:30 p.m., February 7, at the Ayres Hotel in Hawthorne, CA. At this conference which highlights reliability and qualification issues for microelectronics targeted for use in space systems, Craig Hillman will be presenting a paper entitled “Performing Semiconductor Wearout Predictions for State-of-the-Art Integrated Circuits: A Status Update.”  If you would like to meet with Craig while he is in the area, please contact Mark Musitano at mmusitano@dfrsolutions.com.

Event Year: 2017

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IEEE Santa Clara Valley Reliability Chapter Meeting

Date: 02/09/17

Location: SANTA CLARA, CA

On Thursday, February 9, DfR Solutions' CEO and Managing Parter Craig Hillman will be the featured speaker at the February IEEE Santa Clara Valley Reliability Chapter Meeting. The meeting will be held from 6:30-8:00 PM at Qualcomm in Santa Clara, CA. Dr. Hillman will be presenting on, "Copper Pillar, ELK, and Solder: The Challenges of Assembly and Long-Term Reliability at 28nm and 16nm."  

Manufacturing and performance take the forefront in regards to semiconductor packaging. The introduction of copper pillar has helped increase the number of I/O’s and current density. The increasing use of extra low-k (ELK) and ultra low-k (ULK) material, especially at higher metal layers, has allowed for lower RC constants and better performance. However, both of these changes can come at a cost. A number of companies are reporting challenges with these new structures, especially at 28nm and 16nm process nodes. Dr. Hillman’s presentation will review the current status of copper pillar and ELK, the potential risks both introduce into assembly and long-term reliability, and avenues to evaluate and mitigate any life-limiting mechanisms.

Dr. Hillman is an expert in the development and implementation of strategic reliability processes and operations. He is the CEO and Managing Partner of DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry. He has led the company through tremendous growth, making it one of the most highly regarded reliability organizations in the international electronics marketplace.

About IEEE Santa Clara Valley Reliability Chapter:
The IEEE Reliability Society is concerned with strategies and best practices for attaining, assessing, assuring, and sustaining system reliability throughout its life cycle. It provides a professional home for engineering communities or disciplines in these focus areas. This chapter serves members in Santa Clara Valley, CA.

This meeting is open to all members of the IEEE Santa Clara Valley Reliability Chapter for free. 

Event Year: 2017

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2017 Silicon Valley Reliability Symposium

Date: 02/09/17

Location: Santa Clara, CA

DfR Solutions and Ops A La Carte are hosting a free symposium on electronics design reliability. Join us on Thursday, February 9th, 2017 at the Biltmore Hotel and Suites located at 2151 Laurelwood Rd, Santa Clara, CA from 8 am to noon for insightful presentations on reliability topics that will empower you to design better, more reliable products, faster and more cost effectively than ever before. Whether you are developing products for the IoT, Wearables, Consumer, or other innovative markets, this conference is for you.

Event Year: 2017

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IPC APEX 2017

Date: 02/11/17

Location: San Diego, CA

DfR Solutions will be participating in the IPC APEX Expo 2017, February 11-16.

Event Year: 2017

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IMAPS Device Packaging Conference

Date: 03/06/17

Location: Fountain Hills, AZ

Greg Caswell has submitted an abstract entitled “Surviving the Heat Wave – A Presentation on Thermally Induced Failures and Reliability Risks Created by Advancements in Electronics Technologies.” For more information, please contact Greg Caswell.

Event Year: 2017

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2017 Design for Reliability Conference: Implementing Physics of Failure in Electronic Products and Systems

Date: 03/20/17

Location: Baltimore, MD

On Monday, March 20, DfR Solutions is hosting the 2017 Design for Reliability Conference: Implementing Physics of Failure (PoF) in Electronic Products and Systems and registration is open now! The full day conference will take place at the Sheraton Inner Harbor (special room rates are available for conference and training attendees).

Event Year: 2017

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2017 Sherlock Technical Training

Date: 03/21/17

Location: Baltimore, MD

DfR Solutions is offering 2017 Sherlock Technical Training for Sherlock users on Tuesday, March 21 and Wednesday, March 22, after the 2017 Design for Reliability Conference. Training will be held at the Sheraton Inner Harbor with special room rates are available for conference and training attendees. Increase your Sherlock user skills, learn more about critical features and earn a Sherlock User Certificate. We offer two levels of training to our Sherlock Automated Design Analysis™ software users: intermediate and advanced.

Event Year: 2017

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EuroSimE 2017

Date: 04/02/17

Location: Dresden, Germany

Craig Hillman will be the Industrial Keynote presenter at the conference. His topic will be Reliability Calculations in Semiconductors - a Short History of Accomplishments. If you would like to meet with Craig at the conference please contact Mark Musitano.

Event Year: 2017

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