// Central Randomizer: rnd.today=new Date(); rnd.seed=rnd.today.getTime(); function rnd() { rnd.seed = (rnd.seed*9301+49297) % 233280; return rnd.seed/(233280.0); }; function rand(number) { return Math.ceil(rnd()*number); }; // end central randomizer // Start items to be randomized -- Articles, White Papers, Case Studies... // A - Articles (57: = 4 groups of 12 plus 1 group of 9): function articlesgroup1() { var number = rand(12); if (number == 1) return('A Comparison of the Isothermal Fatigue Behavior of SnAgCu to SnPb Solder\<\/a\>'); if (number == 2) return('A Comparison of the Theory of Moisture Diffusion in Plastic Encapsulated Microelectronics with Moisture Sensor Chip and Weight-gain Measurements\<\/a\>'); if (number == 3) return('A Demonstration of Virtual Qualification for the Design of Electronic Hardware\<\/a\>'); if (number == 4) return('A Novel Approach to Identifying and Validating Electrical Leakage in Printed Circuit Boards through Magnetic Current Imaging\<\/a\>'); if (number == 5) return('Accelerated Testing of Surface Mount Solder Joints Using Printed Wiring Board Power Cycling\<\/a\>'); if (number == 6) return('An Engelmaier Model for Leadless Ceramic Chip Devices with Pb-free Solder\<\/a\>'); if (number == 7) return('An Experimental Investigation into the Creep Behavior of Pressure Sensitive Adhesive Tapes for Air-cooled Component-Heat Sink Assemblies\<\/a\>'); if (number == 8) return('An Investigation of the Contact Resistance of a Commercial Elastomer Interconnect under Thermal and Mechanical Stresses\<\/a\>'); if (number == 9) return('Application of 3D Measurement System with CCD Camera in Microelectronics\<\/a\>'); if (number == 10) return('Assessing the Operating Reliability of LGA Elastomer Sockets\<\/a\>'); if (number == 11) return('Assessment of Eutectic Solder Phase Growth in Under-the-hood Power Control Modules\<\/a\>'); if (number == 12) return('Calorimetric Investigation of the Formation of Metastable Silicides in Au\/a-Si Thin-film Multilayers\<\/a\>'); } function articlesgroup2() { var number = rand(12); if (number == 1) return('Characteristics of Stress Relaxation in Encapsulated Molding Compounds\<\/a\>'); if (number == 2) return('Characterization of Some Commercial Thermally-cured Potting Materials\<\/a\>'); if (number == 3) return('Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb\<\/a\>'); if (number == 4) return('Conductive Filament Formation Failure in a Printed Circuit Board\<\/a\>'); if (number == 5) return('Conductive Filament Formation: A Potential Reliability Issue in Laminated Printed Circuit Cards with Hollow Fibers\<\/a\>'); if (number == 6) return('Design Guidelines for Ceramic Capacitors Attached with SAC Solder\<\/a\>'); if (number == 7) return('Design Guidelines for Preventing Flex Cracking Failures in Ceramic Capacitors\<\/a\>'); if (number == 8) return('Determining the Lifetime of Silver-filled Isotropic Conductive Adhesive (ICA)\/Solder-plated Interconnections\<\/a\>'); if (number == 9) return('Diffusion and Absorption of Corrosive Gases in Electronic Encapsulants\<\/a\>'); if (number == 10) return('Do You Know That Your Laminates May Contain Hollow Fibers\?\<\/a\>'); if (number == 11) return('Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints\<\/a\>'); if (number == 12) return('Effects of Conformal Coating on Solder Spreading Phenomenon\<\/a\>'); } function articlesgroup3() { var number = rand(12); if (number == 1) return('Electrochemical Migration on HASL Plated FR-4 Printed Circuit Boards\<\/a\>'); if (number == 2) return('Environmental Aging and Deadhesion of Polyimide Dielectric Films\<\/a\>'); if (number == 3) return('Environmental Aging and Deadhesion of Siloxane-Polyimide-Epoxy Adhesive\<\/a\>'); if (number == 4) return('Epidemiological Study on Sn-Ag-Cu Solder: Benchmarking Results From Accelerated Life Testing\<\/a\>'); if (number == 5) return('Failure Analysis of Electrostatic Discharge and Electrical Overstress Failures of GaAs MMIC\<\/a\>'); if (number == 6) return('Failure Mechanisms in Electronic Products at High Altitudes\<\/a\>'); if (number == 7) return('Failure Mechanisms in LED and Laser Diodes\<\/a\>'); if (number == 8) return('Failures in Base Metal Electrode (BME) Capacitors\<\/a\>'); if (number == 9) return('Finite Element Modeling of Printed Circuit Boards for Structural Analysis\<\/a\>'); if (number == 10) return('Getting the Quality and Reliability Terminology Straight\<\/a\>'); if (number == 11) return('Growth and Selection of Intermetallic Species in Sn-Ag-Cu No-Pb Solder Systems based on Pad Metallurgies and Thermal Histories\<\/a\>'); if (number == 12) return('Has the Electronics Industry Missed the Boat on Pb-free\? Failures in Ceramic Capacitors with Pb-free Solder Interconnects\<\/a\>'); } function articlesgroup4() { var number = rand(12); if (number == 1) return('Hollow Fibers Can Accelerate Conductive Filament Formation\<\/a\>'); if (number == 2) return('Identification of Missing or Insufficient Electrolyte Constituents in Failed Aluminum Electrolytic Capacitors\<\/a\>'); if (number == 3) return('Improved Methodologies for Identifying Root Cause of Printed Board Failures\<\/a\>'); if (number == 4) return('Intermetallic Growth on PWBs Soldered with Sn\3.8\<\/span\>Ag\0.7\<\/span\>Cu\<\/a\>'); if (number == 5) return('Lead Free: Predicting and Ensuring Reliability in Military Avionics\<\/a\>'); if (number == 6) return('Lead-free Solder and Flex Cracking Failures in Ceramic Capacitors\<\/a\>'); if (number == 7) return('Linear Coefficients of Thermal Expansion of Au\0.5\<\/span\>Ni\0.5\<\/span\>Sn\4\<\/span\>, Au\0.75\<\/span\>Ni\0.25\<\/span\>Sn\4\<\/span\>, and AuSn\4\<\/span\>\<\/a\>'); if (number == 8) return('Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints\<\/a\>'); if (number == 9) return('Reliability of Pressure-sensitive Adhesive Tapes for Heat Sink Attachment in Air-cooled Electronic Assemblies\<\/a\>'); if (number == 10) return('Robustness of Surface Mount Aluminum Electrolytic Capacitors When Subjected to Pb-free Reflow\<\/a\>'); if (number == 11) return('Robustness of Surface Mount Multilayer Ceramic Capacitors Assembled with Pb-free Solder\<\/a\>'); if (number == 12) return('Simulation Model Development for FBGA Solder Joint Reliability\<\/a\>'); } function articlesgroup5() { var number = rand(9); if (number == 1) return('Solder Failure Mechanisms in Single-sided Insertion-mount Printed Wiring Boards\<\/a\>'); if (number == 2) return('Solder Metalization Interdiffusion in Microelectronic Interconnects\<\/a\>'); if (number == 3) return('Surface Cracking in Layers Under Biaxial, Residual, Compressive Stress\<\/a\>'); if (number == 4) return('The Effects of Plating Materials, Bond Pad Size, and Bond Pad Geometry on Solder Ball Shear Strength\<\/a\>'); if (number == 5) return('The Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints\<\/a\>'); if (number == 6) return('Thermal Assessment of Glass-Metal Composition Plasma Display Panels Using Design of Experiments\<\/a\>'); if (number == 7) return('Thermal Characteristics of Glass-Metal Composition Plasma Display Panels\<\/a\>'); if (number == 8) return('Using Physics of Failure to Identify Root Cause of Printed Board Failure\<\/a\>'); if (number == 9) return('What I Don\&rsquo\;t Know That I Don\&rsquo\;t Know: Things to Worry About with the Pb-free Transition\<\/a\>'); } // end articles // B - White Papers (24 = 3 groups of 8): function whitepapgroup1() { var number = rand(8); if (number == 1) return('\Bromide Free\<\/a\>'); if (number == 2) return('\Common Reliability Problems in Opto-Electronic Packaging, Epoxies\<\/a\>'); if (number == 3) return('\Derating of Schottky Diodes\<\/a\>'); if (number == 4) return('\Failure Mechanisms in High Voltage PCBs\<\/a\>'); if (number == 5) return('\Five Myths of Reliability\<\/a\>'); if (number == 6) return('\Hollow Fiber Measurement Technique\<\/a\>'); if (number == 7) return('\Know Your Environment\<\/a\>'); if (number == 8) return('\LED Failures\<\/a\>'); } function whitepapgroup2() { var number = rand(8); if (number == 1) return('\NEBS Requirements for Pb-free Electronics\<\/a\>'); if (number == 2) return('\Moisture in Hermetic Packages\<\/a\>'); if (number == 3) return('\NEBS Requirements for Pb-free Electronics\<\/a\>'); if (number == 4) return('\Qualifying for Moisture Containing Environments\<\/a\>'); if (number == 5) return('\Rapid Strength Assessment Technique for AMLCDs\<\/a\>'); if (number == 6) return('\Red Phosphorus-Induced Failures in Encapsulated Circuits\<\/a\>'); if (number == 7) return('\Review of Models for Time-to-Failure Due to Metallic Migration Mechanisms\<\/a\>'); if (number == 8) return('\RoHS Exemptions\<\/a\>'); } function whitepapgroup3() { var number = rand(8); if (number == 1) return('\Temperature Dependence of Electrical Overstress\<\/a\>'); if (number == 2) return('\The Tin Myth\<\/a\>'); if (number == 3) return('\Top 5 EMC Do\&rsquo\;s\ \;\&\; Don\&rsquo\;ts\<\/a\>'); if (number == 4) return('\Uprating of Ceramic Capacitors\<\/a\>'); if (number == 5) return('\Uprating of Crystal Oscillators\<\/a\>'); if (number == 6) return('\Uprating of Electrolytic Capacitors\<\/a\>'); if (number == 7) return('\Vehicle Prognostics to Enable Optimized Maintenance and Logistics\<\/a\>'); if (number == 8) return('\Why HALT Is Not HALT\<\/a\>'); } // end white papers // C - Case Studies (6 = 1 group of 6): function casestudgroup1() { var number = rand(6); if (number == 1) return('\Flex Circuit Supplier Intervention\<\/a\>'); if (number == 2) return('\Identification of BGA Failure\<\/a\>'); if (number == 3) return('\Projection Lamp Failure Analysis\<\/a\>'); if (number == 4) return('\Telecommunications ESD Audit\<\/a\>'); if (number == 5) return('\Tin Whiskers Assessment\<\/a\>'); if (number == 6) return('\Vehicle Prognostics\<\/a\>'); } // end case studies // end to-be-randomized lists