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DfR Solutions has access to leading X-ray equipment to provide comprehensive and prompt failure analysis.

X-ray microscopy has proven to be an important tool in the nondestructive phases of failure analysis.

This technique enables the examiner to localize defects and solder joint anomalies not observable by visual inspection. X-ray microscopy can identify defects such as solder ball voiding in BGA components and thermal header connections, delamination in die attachments, and die shifting.