DfR Solutions Reliability Designed and Delivered


Day One will include technical presentations from world renown industry leaders.  Day Two will include a full day of in-depth tutorials. 
Plus a newly formatted Sherlock Automated Design Analysis™ Software Users Training  will take place on Days Two and Three.

8:00 - 8:45 AM 



8:45 - 9:15 AM



9:15 - 10:00 AM
Keynote: Physics of Failure in Aircraft Development Process:  A Perspective of How to Integrate PoF Electronics Simulation into the Airframe and Systems Development Process 
Alexandre Barbosa dos Santos, Chief Engineer, Embraer

In recent years, during the new aircraft development process, the industry has been struggling to achieve better integration between System and Airframe Design activities and the Reliability Prediction Process.  It seems like two different processes and approaches with low or even no influence in many important design decisions.  The result is false understanding that reliability prediction is a “numbers game”, with greater importance to the MTBF value and the failure rate than to the cause of failure and its respective design solution.

Based on a “smart” System Engineering requirements deployment and proper allocation to allow an easy and clear relationship between aircraft high level objectives and equipment reliability targets, Physics of Failure electronics simulation is, without question, one of the most useful and powerful tools to support design trade-off decisions. Challenges and opportunities between these two “isolated” processes are becoming clearer.  We now have a chance to access better design decisions, in a timely fashion, for thermal and vibration aspects along all product value chains, including airframe, systems and equipment/board level.  This improved process reduces development schedules and costs and increases the delivery of a high level of reliability since EIS.

10:00 - 10:15 AM



10:15 - 11:00 AM
Top Causes of Lithium Ion Battery Field Failures
Dr. Vidyu Challa, DfR Solutions

You want to be proactive about the safety of your battery-powered product, and don't want your company to be on the evening news. Is qualifying your battery manufacturer to industry standards enough? The answer is that most compliance based testing is related to abuse tolerance, but the vast majority of battery field failures happen under normal operating conditions.  Compliance based testing is necessary but not sufficient to ensure lithium ion battery safety and reliability.

In this presentation Dr. Vidyu Challa discusses the main causes of lithium ion battery field failures, whether abuse tests are relevant to field failures, and major areas where risk mitigation strategies should be implemented.

11:00 - 11:45 AM
System Level Effects on Solder Joint Reliability 
Maxim Serebreni, DfR Solutions

Solder interconnects are tasked with providing electrical, thermal and mechanical functionality in electronic packages and assemblies. Under demanding conditions such as temperature fluctuations and vibration solder joints are subjected to higher risk of failure. The influence of system architecture in which solder interconnects are used in could have an impact on solder joint reliability as much as the package type under particular use environment. In this talk factors affecting solder joint reliability on the system level will be covered. Board level reliability concerns will be discussed in relationship to the underlying failure mechanisms of solder interconnects. Deterministic and probabilistic aspects of fatigue life predictions are covered along with case studies of full scale assemblies. State-of-the-art Physics of Failure models will be illustrated along with scalability to system level failure predictions.

11:45 AM - 1:00 PM



1:00 - 1:45 PM
Keynote: Applying Reliability Physics Methods to Functional Safety Hardware Reliability Assessments in ISO-26262
Keith Hodgson, Ford
Jim McLeish, DfR Solutions

The Road Vehicle Functional Safety Standard ISO-26262-2011 part 5 on hardware product development requires a risk assessment of safety related Electrical/Electronic (E/E) hardware using a new, non-traditional metric called the Probabilistic Metric for (random) Hardware Failures (PMHF).  PMHF analysis starts with classical “Part Counting” reliability prediction using actuarial handbooks of historic, averaged failure rates for generic categories of E/E components.  Such methods are based on compressing complex failure histories into simple generic averages, that are treated as a constant factor across the usage life of E/E components. 

In the ISO-26262-2018 Part 5 update, the use of science-based, Reliability Physics Analysis (RPA) implemented in Computer Aided Engineering (CAE) Durability Simulations is recognized as a qualitative reliability/failure risk assessment alternative to purely actuarial-probabilistic methods.

These advanced RPA reliability-durability assessment techniques will be especially important for Autonomous Vehicles which require new advanced, larger and hotter running ICs that will be susceptible to different failure modes and that lack the field history needed for probabilistic prediction. 

This presentation summarizes how RPA/PoF methods outlined in SAE J-1211 and SAE ARP6338 can be applied in ISO-26262 PMHF analysis based on recent trials at Ford. 

1:45 - 2:00 PM



2:00 - 2:45 PM 
Keynote: Reliability Challenges in the Enterprise Hardware Supply Chain
Dave Peters, Hewlett Packard Enterprise




2:45 - 3:00 PM 



3:00 - 3:45 PM 
Housing Design: How to Shock and Waterproof Your Product 
Dr. Nathan Blattau
Michael Blattau

With the explosion in IoT, Wearables, and Automotive Technology, it has never been more important for engineers to know how to design and manufacture enclosures and housing that can protect delicate electronics. In this critical presentation, the DfR team will provide a walk through of the key elements to robust design.

These include:

  • Developing the use case for common applications (what are you designing to?)
  • Understanding industry standards and specifications (don’t reinvent the wheel)
  • Rules of thumb before starting your design (do’s and don’ts)
  • Selecting the right housing materials (Metal? Polymer? Other?)
  • Identifying the solution strategy (O-rings? Welds? Coatings? Dampeners?)

 Through the knowledge gained in this presentation, design teams will be able to accelerate product development, ensure first-pass success, and keep warranty costs low (like, really low).

3:45 - 4:30 PM 
Keynote:  Strain Gauge Data Can Be Misleading. Predicting Strain Levels Caused By Mounting PCB’s in Housings Using the ICT Analysis Feature of Sherlock
Russell Haeberle, PWB Solutions

PCB’s used in automotive applications must be protected from a harsh environmental conditions such as chemical exposure, vibration, heat, cold and mechanical shock. While protecting delicate electronics from these environmental hazards, a housing, if not properly designed will apply sufficient forces to the PCB to damage components. If the damage is catastrophic end of line testing may capture the failure. If the assembly is only wounded, there is increased potential for latent field failures. As component manufacturer’s shrink package sizes it is becoming more difficult to accurately measure component and solder joint strain using conventional strain gauges. By using the ICT analysis function in Sherlock one can estimate the strain levels of components and solder joints. 

 The talk will include cross section images of solder joint failures on BGA’s, QFN’s, and QFP’s caused by housing induced strain. Results of actual strain gauge measurements indicating low strain levels will be compared to a Sherlock analysis which predicted unacceptably high strain levels.

Register Today!

Register for Conference Presentations  Monday, March 19, 2018 $99