In order to download conference presentation slides, simply click on the title of the presentation that you are interested in viewing. 

Monday, March 25, 2019 - Day One

• "Case Study: How Continental Automotive is Integrating Sherlock into their Design Process" presented by Tony Asghari, Continental Automotive & Gil Sharon, DfR Solutions
  • "Continental Automotive Tests Its Product Reliability in a Fraction of Time Before Building Prototype" (Handout)
  • "Sherlock for Predicting Thermal Stress Fatigue in Solder Balls" (Handout)
  • "Investigating the Effect of Solder Geometry and Board Boundary Conditions on Solder Thermal Fatigue" (Handout)
• "What's New with Sherlock?" presented by Natalie Hernandez, DfR Solutions
• "Will Your Battery Protection System and UL Test Prevent Catastrophic Lithium Ion Failures?" presented by Vidyu Challa, DfR Solutions
• "DfX in Electronics Packaging" presented by Kayleen Helms, Intel
• "Warranty-Reliability-Maintainability: How OptimalPlus and Sherlock Allow for Comprehensive Prediction Throughout the Product Lifecycle" presented by Dan Sebban, OptimalPlus & Dr. Craig Hillman,  DfR Solutions
• "Case Study: TCT Model Verification for NAND BGAs" presented by Ken Symonds, Western Digital
• "Best Practices in Reliability Management of Consumer PCs" presented by Ed Tinsley, Dell
• "Electrical Overstress (EOS) in Semiconductors: An Introduction to Electrically Induced Physical Damage" presented by Stevan Hunter, Onsemi & Ashok Alagappan, DfR Solutions

Tuesday, March 26, 2019 - Day Two

• "How to Implement a Proactive Approach to Identifying Reliability Risks" presented by John Coates, ZF Friedrichshafen
• "Using Simulation to Optimize Microvia Placement and Materials to Avoid Failures During Reflow" presented by Kourosh Kalayeh, DfR Solutions
• "A Corporate-Level Process Flow to Ensure Quality and Reliability" presented by Martin Novak, Arris International
• "Using Reliability Physics Analysis to Predict Thermal Cycling BGA Failures for Aircraft Engines" presented by Don McNally, Woodward
• "The Implementation of the NUD Process" presented by Joe Powell, Lennox
• "Accurately Capturing System-Level Failures of Solder Joints" presented by Maxim Serebreni, DfR Solutions
• "How to Successfully Implement J3168 SAE Standards in Your Supply Chain" presented by Jim McLeish, DfR Solutions
• "Understanding and Mitigating Chip-Package-Board Interactions (CPBI)" presented by Gil Sharon, DfR Solutions

Poster Sessions

• "Risks of Wide Band Gap (WBG) Semiconductors in Power Supply Applications" presented by Craig Hillman
• "Predicting the Failure Rate of Next Generation Integrated Circuits using Reliability Physics" presented by Ashok Allagappan
• "Life extension Through Predictive Maintenance" presented by Ed Dodd
• "Practical application of AEC requirements for automotive components (passives and ICs)" presented by Chris South
• "Key Lessons from Performing Finite Element Analysis (FEA) on Semiconductor Packaging, Printed Circuit Boards, and Electronic Assemblies" presented by Josh Akman & Tyler Ferris
• "Accelerated Radiation Susceptibility Analysis and Prediction (RadSAP) Tool" presented by Greg Caswell & Ashok Allagappan,
• "Design for Reliability for Connectors: A Review of Failure Modes and Mitigations" presented by Michael Blattau