DfR Solutions Reliability Designed and Delivered

In the News:

DFR SOLUTIONS TO TACKLE THERMAL ISSUES IN ELECTRONICS AT INTERPACK

DfR Solutions announced that it would be presenting two sessions at InterPACK, Packaging and Integration of Electronic and Photonic Microsystems, August 27 and 28 in San Francisco.  Dr. Vidyu Challa will present How to Qualify Your Batteries to Prevent Failures and Thermal Events on August 27 and participate in the Women in Engineering Panel on August 28. Maxim Serebreni will present the paper, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects.

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