DfR Solutions | Insights

Best Practices in Test Plan Preparation

Board Level Reliability Testing: Current Challenges

How to Develop Board Level Reliability Test Plan

A COMPARISON OF THE ISOTHERMAL FATIGUE BEHAVIOR OF SN-AG-CU TO SN-PB SOLDER

Thermal Mechanical Simulations of BGAs for the Automotive Environment

Preserving Electronic Design IP via Locked IP Model

The Best Method to Calculate Risk of Failure and System-level Effects

The Roles of Reliability and Safety in AV Development

Are Lithium-Ion Battery Explosions Increasing?

Are Lithium-Ion Cells You Buy Online Always Legit?

Why Do Lithium-Ion Batteries Swell?

3 Real Life Examples Of “After A Failure” Investigations

Top 5 Reasons for Solder Joint Failure

Exploring Semiconductor Reliability

DfR Solutions is the Healthcare Provider for the Electronics Industry - Say What?

3 Real Life Examples of “Before a Failure” Investigations

Identifying Common Electronic Failures

Top 5 Blog Posts from 2017

Flexible Electronics – Technology and Challenges

Top Six Ways To Lower Warranty Costs

Maximize Reliable Electronic Product Development Using Physics of Failure (PoF)

Can Standards-Based Testing Prevent Lithium-Ion Battery Field Failures?

How to Accurately Assess PCB Warpage and Solder Joint Fatigue in QFN Packages

7 Months In: The Electronics Reliability Industry from a New Engineer’s Perspective

Overcoming Qualification Method Challenges for Semiconductor Devices in Avionics Systems

The Value of Digital Image Correlation in Electronic Design and Root Cause Analysis

Reliability in Avionics: Using Virtual Prototyping, Simulation and PoF

How to Evaluate Integrated Circuit (IC) Components for High Reliability Applications

How Physics of Failure Helps Bring Reliable Avionics Products to Market Faster

Reliability Update at DfR Solutions

What is Physics of Failure?

Integrating Physics of Failure (PoF) into Complex Systems

How to Ensure Electronic Product Reliability When You Don’t Have Time to Test

Solder Joint Reliability — Exposing the Weakest Link

Does Anyone Care About Tin Whiskers Anymore?

Understanding the Root Causes of Battery Failure

Two Most Effective Tools to Reduce Warranty Cost

What 45 Years in the Electronics Industry Teaches You

Watch On Demand: Coatings and Pottings — A Critical Update Webinar

How to Ensure Reliability of Aerospace Commercial Off-the-Shelf Parts (COTS)

How to Select the Right Battery for Your Application? Part 3: Common Secondary Battery Chemistries

Implementing Physics of Failure in Electronic Boxes

How to Select the Right Battery for Your Application? Part 2: Common Primary Battery Chemistries

Lessons Learned from the Samsung Galaxy Note 7 Battery Fires

Facing the Challenges of Self-driving Vehicle Technology

How to Select the Right Battery for Your Application? Part 1: Important Battery Metric Considerations

How to Implement Physics of Failure Techniques

Improving Speed to Market by Integrating Design for Reliability (DfR) with Design for Six Sigma (DFSS)

How Modeling for Component Packaging Has Changed

What is Mean Time Between Failure (MTBF)?

Top 4 Issues of Semiconductor Power Supply Transformers

Featured Webinar: Simulated Aided Testing/Simulated Guided Testing

4 Factors That Must Be Addressed During Product Lifecycle Simulation

3 Ways to Mitigate Manufacturing Failure Risk

How to Eliminate the Need for Failure Analysis

How to Achieve High Reliability in Automotive Applications

3 Characteristics of Structured Root Cause Analysis

Evaluating the Impact of Prolonged Thermal Cycling on Automotive Reliability

Reduce Rework with Virtual PCB Prototyping and Simulation

How to Predict and Prevent Automotive Power Module Failure

How Robust Designs Enhance Automotive Power Module Reliability

Featured Webinar: Learn the 3 Fundamentals to Ultimate Consumer Electronics Reliability

How To Answer Reliability and Insurance Questions After an Adverse Event

Optimizing Automotive Component Reliability with Sherlock

Meet Dr. Vidyu Challa, DfR Technical Director

Reliability Modeling of MEMS in Automotive Systems

Evaluating CAE Tools For Predicting MEMS Reliability

Optimizing BGAs and QFNs Using Physics of Failure

BGA and QFN Failure Mitigation: Underfilling, Edge Bonds and Corner Staking

Featured Webinar: Learn how to accelerate FEA in Abaqus, Ansys and NX Nastran

Migrating Vehicle Evaluations from the Road to the Computer

Solving Module-Level Copper Wire Bonded ICs Failures

Automotive Industry Challenges of Replacing Gold Wire Bonds with Copper

Are GPUs reliable enough to be an autonomous vehicle’s brain?

How to Assure Compliance with Stringent New Vehicle Safety Legislation

How Physics Based Modeling Delivers a Better, Lower Cost Car

Mark Your Calendar: Join DfR Solutions at September Industry Conferences

Understanding the Risk of Gold Flash

Featured Webinar: Best Practices in Implementing Physics of Failure into the Design Process

Unique Reliability Challenges Presented by Automotive Electronics

Save the Date: Upcoming International Conference Features DfR Solutions

Solving Problems of Overly Constrained Boards

The Challenges of Wireless Reliability

An Introduction to the Wireless Internet of Things (IoT)

Sherlock 5.0 - New Features Make a Great Software Tool Even More Robust

Announcing Sherlock 5.0

What is Design for Reliability (DfR)?

Concurrent Engineering Breaks the Design-Build-Test-Fix Iterative Process

Next Generation Technology: What Does It Mean for the Reliability of Wearables?

Reliability and Customer Expectations MUST Drive Wearable Electronics Design

Wearable Electronics and Reliability: An Overview (Part 2)

Wearable Electronics and Reliability: An Overview (Part 1)

What is DFMEA?

Guarantee PCB Reliability with Vibration Simulation and Testing

Industry Spotlight: Sherlock Automated Design Analysis™ Software Insight Saves Auto Manufacturer Nearly $1.4 Million

How to Maximize HALT Root Cause Analysis

How to Plan and Conduct Highly Accelerated Life Testing (HALT)

What is HALT?

Thermal Management Solutions: How Hot is Too Hot for Integrated Circuits and Solder Joints?

Thermal Management Solutions: How Hot is Too Hot for Electrolytic Capacitors?

Thermal Management Solutions: How Hot is Too Hot for LEDs?

Thermal Management Solutions: How Hot is Too Hot for Magnetics?

Thermal Testing Challenges to Reliability and How To Solve Them

Test Plan Development Using Sherlock Automated Design Analysis™ Software

Developing a Test Plan Using Physics of Failure

How Design for Reliability (DfR) Best Practices Impact Electronics Production

How To Evaluate DfR Tools for Successful Reliability Testing

Industry Spotlight: Sherlock Automated Design Analysis™ Software feedback speeds time to market for auto manufacturer

How Finite Element Analysis Benefits from Sherlock Automated Design Analysis™ Software

Optimizing PCB Design Through Complex Computerized Modeling and Simulation

Reliability Modeling Software Reduces Testing Time, Improves Results for Innovative Auto Electronics

Advancements in Reliability Prediction Simulations and Why They Matter

A Brief Overview of Failure Mechanism Models

Why Physics of Failure is Preferred to MTBF for Reliability Testing

The Past, Present & Future of Physics of Failure