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DfR Solutions' Insights
How to Improve an FEA Model: Proper Load Applications
How to Improve an FEA Model: Proper Mesh Generation
How to Improve an FEA Model: Model Simplification
Digital Image Correlation: What it is and Common Pitfalls
Red Phosphorus and Electronic Failures
Using FEA to identify Microvias and PTHs at Risk of Failure
Power Semiconductor Unique Capabilities in the New Use Environments
Why Flux Residue Can Cause Electronics Failures
Power Supply Components And Thermal Stress
How the Battery Supply Chain is Changing
Underfill Applications, Materials & Methods
Design Review Process
What's New With Sherlock 6.2?
Considerations for Test Plan Development
Best Practices in Test Plan Preparation
Board Level Reliability Testing: Current Challenges
How to Develop Board Level Reliability Test Plan
A COMPARISON OF THE ISOTHERMAL FATIGUE BEHAVIOR OF SN-AG-CU TO SN-PB SOLDER
Thermal Mechanical Simulations of BGAs for the Automotive Environment
Preserving Electronic Design IP via Locked IP Model
The Best Method to Calculate Risk of Failure and System-level Effects
The Roles of Reliability and Safety in AV Development
Are Lithium-Ion Battery Explosions Increasing?
Are Lithium-Ion Cells You Buy Online Always Legit?
Why Do Lithium-Ion Batteries Swell?
3 Real Life Examples Of “After A Failure” Investigations
Top 5 Reasons for Solder Joint Failure
Exploring Semiconductor Reliability
DfR Solutions is the Healthcare Provider for the Electronics Industry - Say What?
3 Real Life Examples of “Before a Failure” Investigations
Identifying Common Electronic Failures
Top 5 Blog Posts from 2017
Flexible Electronics – Technology and Challenges
Top Six Ways To Lower Warranty Costs
Maximize Reliable Electronic Product Development Using Physics of Failure (PoF)
Can Standards-Based Testing Prevent Lithium-Ion Battery Field Failures?
How to Accurately Assess PCB Warpage and Solder Joint Fatigue in QFN Packages
7 Months In: The Electronics Reliability Industry from a New Engineer’s Perspective
Overcoming Qualification Method Challenges for Semiconductor Devices in Avionics Systems
The Value of Digital Image Correlation in Electronic Design and Root Cause Analysis
Reliability in Avionics: Using Virtual Prototyping, Simulation and PoF
How to Evaluate Integrated Circuit (IC) Components for High Reliability Applications
How Physics of Failure Helps Bring Reliable Avionics Products to Market Faster
Reliability Update at DfR Solutions
What is Physics of Failure?
Integrating Physics of Failure (PoF) into Complex Systems
How to Ensure Electronic Product Reliability When You Don’t Have Time to Test
Solder Joint Reliability — Exposing the Weakest Link
Does Anyone Care About Tin Whiskers Anymore?
Understanding the Root Causes of Battery Failure
Two Most Effective Tools to Reduce Warranty Cost
What 45 Years in the Electronics Industry Teaches You
Watch On Demand: Coatings and Pottings — A Critical Update Webinar
How to Ensure Reliability of Aerospace Commercial Off-the-Shelf Parts (COTS)
How to Select the Right Battery for Your Application? Part 3: Common Secondary Battery Chemistries
Implementing Physics of Failure in Electronic Boxes
How to Select the Right Battery for Your Application? Part 2: Common Primary Battery Chemistries
Lessons Learned from the Samsung Galaxy Note 7 Battery Fires
Facing the Challenges of Self-driving Vehicle Technology
How to Select the Right Battery for Your Application? Part 1: Important Battery Metric Considerations
How to Implement Physics of Failure Techniques
Improving Speed to Market by Integrating Design for Reliability (DfR) with Design for Six Sigma (DFSS)
How Modeling for Component Packaging Has Changed
What is Mean Time Between Failure (MTBF)?
Top 4 Issues of Semiconductor Power Supply Transformers
Featured Webinar: Simulated Aided Testing/Simulated Guided Testing
4 Factors That Must Be Addressed During Product Lifecycle Simulation
3 Ways to Mitigate Manufacturing Failure Risk
How to Eliminate the Need for Failure Analysis
How to Achieve High Reliability in Automotive Applications
3 Characteristics of Structured Root Cause Analysis
Evaluating the Impact of Prolonged Thermal Cycling on Automotive Reliability
Reduce Rework with Virtual PCB Prototyping and Simulation
How to Predict and Prevent Automotive Power Module Failure
How Robust Designs Enhance Automotive Power Module Reliability
Featured Webinar: Learn the 3 Fundamentals to Ultimate Consumer Electronics Reliability
How To Answer Reliability and Insurance Questions After an Adverse Event
Optimizing Automotive Component Reliability with Sherlock
Meet Dr. Vidyu Challa, DfR Technical Director
Reliability Modeling of MEMS in Automotive Systems
Evaluating CAE Tools For Predicting MEMS Reliability
Optimizing BGAs and QFNs Using Physics of Failure
BGA and QFN Failure Mitigation: Underfilling, Edge Bonds and Corner Staking
Featured Webinar: Learn how to accelerate FEA in Abaqus, Ansys and NX Nastran
Migrating Vehicle Evaluations from the Road to the Computer
Solving Module-Level Copper Wire Bonded ICs Failures
Automotive Industry Challenges of Replacing Gold Wire Bonds with Copper
Are GPUs reliable enough to be an autonomous vehicle’s brain?
How to Assure Compliance with Stringent New Vehicle Safety Legislation
How Physics Based Modeling Delivers a Better, Lower Cost Car
Mark Your Calendar: Join DfR Solutions at September Industry Conferences
Understanding the Risk of Gold Flash
Featured Webinar: Best Practices in Implementing Physics of Failure into the Design Process
Unique Reliability Challenges Presented by Automotive Electronics
Save the Date: Upcoming International Conference Features DfR Solutions
Solving Problems of Overly Constrained Boards
The Challenges of Wireless Reliability
An Introduction to the Wireless Internet of Things (IoT)
Sherlock 5.0 - New Features Make a Great Software Tool Even More Robust
Announcing Sherlock 5.0
What is Design for Reliability (DfR)?
Concurrent Engineering Breaks the Design-Build-Test-Fix Iterative Process
Next Generation Technology: What Does It Mean for the Reliability of Wearables?
Reliability and Customer Expectations MUST Drive Wearable Electronics Design
Wearable Electronics and Reliability: An Overview (Part 2)
Wearable Electronics and Reliability: An Overview (Part 1)
What is DFMEA?
Guarantee PCB Reliability with Vibration Simulation and Testing
Industry Spotlight: Sherlock Automated Design Analysis™ Software Insight Saves Auto Manufacturer Nearly $1.4 Million
How to Maximize HALT Root Cause Analysis
How to Plan and Conduct Highly Accelerated Life Testing (HALT)
What is HALT?
Thermal Management Solutions: How Hot is Too Hot for Integrated Circuits and Solder Joints?
Thermal Management Solutions: How Hot is Too Hot for Electrolytic Capacitors?
Thermal Management Solutions: How Hot is Too Hot for LEDs?
Thermal Management Solutions: How Hot is Too Hot for Magnetics?
Thermal Testing Challenges to Reliability and How To Solve Them
Test Plan Development Using Sherlock Automated Design Analysis™ Software
Developing a Test Plan Using Physics of Failure
How Design for Reliability (DfR) Best Practices Impact Electronics Production
How To Evaluate DfR Tools for Successful Reliability Testing
Industry Spotlight: Sherlock Automated Design Analysis™ Software feedback speeds time to market for auto manufacturer
How Finite Element Analysis Benefits from Sherlock Automated Design Analysis™ Software
Optimizing PCB Design Through Complex Computerized Modeling and Simulation
Reliability Modeling Software Reduces Testing Time, Improves Results for Innovative Auto Electronics
Advancements in Reliability Prediction Simulations and Why They Matter
A Brief Overview of Failure Mechanism Models
Why Physics of Failure is Preferred to MTBF for Reliability Testing
The Past, Present & Future of Physics of Failure