printed circuit board
Digital Image Correlation (DIC) is a non-contact, full field displacement optical measurement technique.
It is most often used in the following applications:
- Material characterization (CTE, glass transition temperature, Young’s Modulus, Poisson’s Ratio)
- Sample testing – fatigue and failure (in situ monitoring of displacements and strains)
- Applications where displacement or deformation measurements are needed
- High speed/frequency applications (i.e. crash testing, vibration)
Picture: A connector that shows evidence of corrosion from red phosphorus.
Electronics manufacturing is a complicated business. Consumer demand, manufacturing supply chains, materials, and regulations are constantly changing. Every company wants to be the first to market with the newest, coolest, most profitable technology. But sometimes the rush to get to market leaves safety and reliability in the dust. Design review and thorough supply chain assessment help mitigate electronic failure risks before they happen. Unfortunately, we get to see the same mistakes being made over and over again.