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Considerations for Test Plan Development

In a previous DfR Solutions insight titled Best Practices in Test Plan Preparation, we discussed some of the most important techniques and philosophies when preparing to develop a testing plan for electronic products. What makes those techniques so powerful is that they are ubiquitous: with any design, reviewing the bill of materials, identifying use environments and assessing failure history are both applicable and crucial.

However, what that article did not discuss is that there are considerations that need to be applied in very specific ways. The following are strategies for test plan development that are dependent on specific use cases, parameters, goals, configurations and limitations. While they are just as powerful as our Best Practices, they require a thorough understanding of your product and a clear and agreed-upon set of goals throughout the supply chain.

Topic: Electronics Reliability, electronics test design, Mechanical Design, Reliability Physics, Standards Based Testing

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What 45 Years in the Electronics Industry Teaches You

When considering recent advances in technology like autonomous vehicles or cloud computing, it’s easy to forget that as little as 20 years ago, most people didn’t have a home computer. The internet wasn’t fully functioning until the late 1990s and mobile access wasn’t commonplace until the dawn of the 21st century.

Topic: Design for Reliability

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How Modeling for Component Packaging Has Changed

The constant demand for smaller, faster, more reliable electronic components continues to drive innovation in component packaging. Component engineers are relentless in their quest for new and better ways to improve BGAs and packaging silicon. Recent advancements include going coreless and multi-chip modules, but silicon technology advances dictate continued improvement in packaging.

Topic: Sherlock

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Top 4 Issues of Semiconductor Power Supply Transformers

Converting AC voltage to higher or lower amounts in semiconductors and other applications requires that power supplies use transformers. The solution is a simple one, yet there are four common issues power supply transformers face that can inhibit reliability.

Topic: Physics of Failure

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4 Factors That Must Be Addressed During Product Lifecycle Simulation

Product lifecycle simulation is an effective tool for determining how long electronics in automotive and other applications will perform before failing. However, there are four distinct categories of electronics with disparate levels of lifetime expectations:

Topic: Sherlock

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How to Eliminate the Need for Failure Analysis

Nearly one-fifth of electronics designs that are tested fail. That means nearly one-fifth of electronics designs are reworked or scrapped in favor of a new design. The resulting production delays and cost overruns mount, further threatening profitability in an automotive industry that’s already grappling with the margin-shrinking impact of increasing price-based competition. 

Topic: Sherlock

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How to Predict and Prevent Automotive Power Module Failure

Just because an automotive power module has a projected 20-year life expectancy doesn’t guarantee long-term reliability. In fact, these modules are routinely exposed to vibration, shock, humidity, salt spray and other factors that can quickly degrade power and ultimately cause failure. 

Topic: Sherlock

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How Robust Designs Enhance Automotive Power Module Reliability

The automotive industry, among others, depends on power modules to house and protect delicate semiconductors and other components that power various automobile functions. Given the vital importance of power modules in relation to product reliability, a robust design must be in place in order to mitigate risk from defect, create margins and ultimately satisfy customer expectations.

Topic: Sherlock

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How To Answer Reliability and Insurance Questions After an Adverse Event

Reliability is the desired result of product design and testing. Rightly so, as everything from functionality, safety and a brand’s reputation hinges on it.

Topic: Sherlock

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Solving Module-Level Copper Wire Bonded ICs Failures

Over the past two decades gold prices have increased nearly $1,000 per Troy ounce, necessitating a transition to replace gold with copper bond wires in integrated circuits (ICs). This seemingly small change is actually very significant. The differences between the metals’ properties require full optimization of each module in order to compensate for the nuances of the copper wire bonds (Cu-WBs).

Topic: Sherlock

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